USD406113SExpiredUtility

Processing tube for use in a semiconductor wafer heat processing apparatus

Assignee: TOKYO ELECTRON LTDPriority: Jan 31, 1997Filed: Jul 24, 1997Granted: Feb 23, 1999

Est. expiryJan 31, 2017(expired)· nominal 20-yr term from priority

PatentIndex Score

Cited by

References

Claims

exact text as granted — not AI-modified

I claim the ornamental design for processing tube for use in a semiconductor wafer heat processing apparatus, as shown and described.

Join the waitlist — get patent alerts

Track USD406113S — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.