USD588078SExpiredUtility

Heat dissipation deterrence link for semiconductor manufacture

63
Assignee: TOKYO ELECTRON LTDPriority: Jun 16, 2006Filed: Dec 15, 2006Granted: Mar 10, 2009
Est. expiryJun 16, 2026(expired)· nominal 20-yr term from priority
Inventors:Mitsuhiro OkadaYoshikazu FurusawaDaisuke Suzuki
63
PatentIndex Score
13
Cited by
15
References
1
Claims

Claims

exact text as granted — not AI-modified
CLAIM 
     
       The ornamental design for a heat dissipation deterrence link for semiconductor manufacture, as shown and described.

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