USD839224SActiveUtility

Elastic membrane for semiconductor wafer polishing

89
Assignee: EBARA CORPPriority: Dec 12, 2016Filed: Jun 9, 2017Granted: Jan 29, 2019
Est. expiryDec 12, 2036(~10.4 yrs left)· nominal 20-yr term from priority
Inventors:Satoru YamakiMakoto FukushimaKeisuke NamikiOsamu NabeyaShingo TogashiTomoko OwadaMasahiko Kishimoto
89
PatentIndex Score
28
Cited by
32
References
1
Claims

Claims

exact text as granted — not AI-modified
CLAIM 
     
       The ornamental design for an elastic membrane for semiconductor wafer polishing, as shown and described.

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