USD859332SActiveUtility

Elastic membrane for semiconductor wafer polishing

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Assignee: EBARA CORPPriority: Jun 29, 2017Filed: Dec 21, 2017Granted: Sep 10, 2019
Est. expiryJun 29, 2037(~10.9 yrs left)· nominal 20-yr term from priority
Inventors:Satoru YamakiMakoto FukushimaKeisuke NamikiOsamu NabeyaShingo TogashiTomoko Owada
66
PatentIndex Score
10
Cited by
11
References
1
Claims

Claims

exact text as granted — not AI-modified
CLAIM 
     
       The ornamental design for an elastic membrane for semiconductor wafer polishing, as shown and described.

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