USD981969SActiveUtility

Elastic membrane for semiconductor wafer polishing apparatus

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Assignee: EBARA CORPPriority: Dec 18, 2020Filed: Jun 15, 2021Granted: Mar 28, 2023
Est. expiryDec 18, 2040(~14.4 yrs left)· nominal 20-yr term from priority
Inventors:Kenichi AkazawaTomoko OwadaOsamu NabeyaMakoto FukushimaYuichi Kato
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PatentIndex Score
0
Cited by
16
References
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Claims

Claims

exact text as granted — not AI-modified
CLAIM 
     
       The ornamental design for an elastic membrane for semiconductor wafer polishing apparatus, as shown and described.

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