Lamp for rapid thermal processing chamber

Abstract

A lamp assembly adapted for use in a substrate thermal processing chamber to heat the substrate to temperatures up to at least about 1100° C. is disclosed. In one embodiment, the lamp assembly comprises a bulb enclosing at least one radiation generating filament attached to a pair of leads, a lamp base configured to receive the pair of leads, a sleeve having a wall thickness of at least about 0.013 inches and a potting compound having a thermal conductivity greater than about 100 W/(K-m).

The invention claimed is: 
     
       1. A lamp assembly comprising:
 a bulb enclosing at least one radiation generating filament attached to a pair of leads, the bulb having an inner surface an outer surface; 
 a lamp base configured to receive the pair of leads; 
 a metal sleeve surrounding the lamp base and filled with a potting compound, the sleeve having a wall thickness of at least about 0.013 inches and the potting compound having a thermal conductivity exceeding about 100 W/(K-m), the lamp assembly adapted for use in a substrate processing chamber to heat the substrate to temperatures up to at least about 1100° C. 
 
     
     
       2. The lamp assembly of  claim 1 , wherein the potting compound has a thermal conductivity exceeding about 150 W/(K-m). 
     
     
       3. The lamp assembly of  claim 1 , wherein the potting compound has a thermal conductivity exceeding about 200 W/(K-m). 
     
     
       4. The lamp assembly of  claim 2 , wherein the wall thickness of the sleeve exceeds about 0.040 inches. 
     
     
       5. The lamp assembly of  claim 3 , wherein the wall thickness of the sleeve exceeds about 0.050 inches. 
     
     
       6. The lamp assembly of  claim 1 , wherein sleeve is made from copper or aluminum. 
     
     
       7. The lamp assembly of  claim 1 , wherein the potting compound comprises magnesium phosphate bonded aluminum nitride. 
     
     
       8. The lamp assembly of  claim 1 , wherein potting compound comprises an epoxy based potting compound. 
     
     
       9. The lamp assembly of  claim 8 , wherein the epoxy based potting compound further comprises copper or silver. 
     
     
       10. The lamp assembly of  claim 1 , wherein the cross-sectional shape of the sleeve substantially conforms to the cross-sectional shape of the lamp base. 
     
     
       11. The lamp assembly of  claim 10 , wherein the cross-sectional shape of the sleeve is substantially rectangular. 
     
     
       12. A lamp assembly comprising:
 a bulb enclosing at least one radiation generating filament attached to a pair of leads, the bulb having an inner surface an outer surface; 
 a lamp base configured to receive the pair of leads; 
 a first potting compound having a thermal conductivity exceeding about 100 W/(K-m) surrounding the base, the lamp assembly adapted for use in a substrate processing chamber to heat the substrate to temperatures up to at least about 1100° C. 
 
     
     
       13. The lamp assembly of  claim 12 , wherein the thermal conductivity of the potting compound exceeds about 150 W/(K-m). 
     
     
       14. The lamp assembly of  claim 12 , wherein the thermal conductivity of the potting compound exceeds about 200 W/(K-m). 
     
     
       15. The lamp assembly of  claim 12 , further comprising a copper or aluminum sleeve surrounding the potting compound. 
     
     
       16. The lamp assembly of  claim 15 , further comprising a second potting compound located adjacent the bulb, the second potting compound having a lower thermal conductivity and a higher reflectivity than the first potting compound. 
     
     
       17. The lamp assembly of  claim 16 , wherein the first potting compound comprises an epoxy based aluminum nitride compound and the second potting compound comprises a zirconia based potting compound. 
     
     
       18. The lamp assembly of  claim 16 , wherein the second potting compound is present in a layer having a thickness of less than about 1 mm. 
     
     
       19. The lamp assembly of  claim 15 , wherein the metal sleeve has a wall thickness of at least about 0.020 inches. 
     
     
       20. The lamp assembly of  claim 16 , wherein the metal sleeve has a wall thickness of at least about 0.040 inches. 
     
     
       21. A rapid thermal processing lamp assembly comprising:
 a sleeve having a longitudinal axis, a first end, and a second end extending from the first end; and   a lamp element including a bulb enclosing at least one radiation generating filament attached to a pair of leads, the bulb having an inner surface, an outer surface, and a lamp base configured to receive the pair of leads, the lamp element adapted for use in a substrate processing chamber to heat the substrate to temperatures of 1100° C., and the first end of the sleeve surrounding at least a portion the lamp base, and a potting compound optionally inside the sleeve, the sleeve having a wall with a thickness of at least about 0.013 inches and being made from material selected from copper and aluminum.   
     
     
       22. The lamp assembly of claim 21 wherein the sleeve is copper. 
     
     
       23. The lamp assembly of claim 21, wherein the sleeve is aluminum. 
     
     
       24. The lamp assembly of claim 21, wherein the sleeve comprises a tube having little or no potting compound contained within the tube. 
     
     
       25. The lamp assembly of claim 24, wherein the tube is substantially a solid with conduits provided for wires. 
     
     
       26. The lamp assembly of claim 22, wherein the sleeve has a wall with a thickness of at least about 0.020 inches. 
     
     
       27. The lamp assembly of claim 22, wherein the sleeve has a wall thickness of at least about 0.040 inches. 
     
     
       28. The lamp assembly of claim 23, wherein the sleeve has a wall with a thickness of at least about 0.020 inches. 
     
     
       29. The lamp assembly of claim 23, wherein the sleeve has a wall thickness of at least about 0.040 inches. 
     
     
       30. The lamp assembly of claim 21, wherein the sleeve contains potting compound.