Assignee
LINDERT NICK
US·5 granted patents·7 pending applications·24 citations·filing 2006–2015
Top patents by PatentIndex Score
12 records- 0188US9691839B2Metal-insulator-metal (MIM) capacitor with insulator stack having a plurality of metal oxide layersLINDERT NICK·Filed 2011·Granted Jun 27, 2017·12 cites·37 claims
- 0279US9076758B2Rectangular capacitors for dynamic random access (DRAM) and dual-pass lithography methods to form the sameLINDERT NICK·Filed 2013·Granted Jul 7, 2015·4 cites·6 claims
- 0378US8502293B2Capacitor with recessed plate portion for dynamic random access memory (DRAM) and method to form the sameLINDERT NICK·Filed 2010·Granted Aug 6, 2013·5 cites·37 claims
- 0468US9565766B2Formation of DRAM capacitor among metal interconnectLINDERT NICK·Filed 2011·Granted Feb 7, 2017·2 cites·31 claims
- 0567US9577030B2Semiconductor structure having a capacitor and metal wiring integrated in a same dielectric layerLINDERT NICK·Filed 2015·Granted Feb 21, 2017·1 cites·6 claims
- 0649US2006197164A1Epitaxially deposited source/drainLINDERT NICK·Filed 2006·Application pending·0 cites
- 0747US2012223413A1Semiconductor structure having a capacitor and metal wiring integrated in a same dielectric layerLINDERT NICK·Filed 2011·Application pending·0 cites
- 0845US2012161215A1Rectangular capacitors for dynamic random access memory (dram) and dual-pass lithography methods to form the sameLINDERT NICK·Filed 2010·Application pending·0 cites
- 0942US2007224775A1Trench isolation structure having an expanded portion thereofLINDERT NICK·Filed 2006·Application pending·0 cites
- 1041US2009001415A1Multi-gate transistor with strained bodyLINDERT NICK·Filed 2007·Application pending·0 cites
- 1140US2013292797A1Fully encapsulated conductive linesLINDERT NICK·Filed 2011·Application pending·0 cites
- 1237US2014001598A1Atomic layer deposition (ald) of taalc for capacitor integrationLINDERT NICK·Filed 2011·Application pending·0 cites
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