Assignee
MEC CO LTD
JP·46 granted patents·23 pending applications·639 citations·filing 1990–2024
Top patents by PatentIndex Score
69 records- 0190US5532094AComposition for treating copper or copper alloy surfacesMEC CO LTD·Filed 1995·Granted Jul 2, 1996·96 cites·6 claims
- 0289US5965036AMicroetching composition for copper or copper alloyMEC CO LTD·Filed 1997·Granted Oct 12, 1999·82 cites·15 claims
- 0388US6426020B1Etchant for copper or copper alloysMEC CO LTD·Filed 2000·Granted Jul 30, 2002·58 cites·20 claims
- 0484US5807493AMicroetching method for copper or copper alloyMEC CO LTD·Filed 1996·Granted Sep 15, 1998·59 cites·5 claims
- 0583US5496590AComposition for treating copper and copper alloy surfaces and method for the surface treatmentMEC CO LTD·Filed 1994·Granted Mar 5, 1996·32 cites·3 claims
- 0683US5435860ABenzimidazole derivative and composition for treating copper and copper alloy surfaces comprising the sameMEC CO LTD·Filed 1994·Granted Jul 25, 1995·26 cites·4 claims
- 0781US5035749AProcess for removing tin and tin-lead alloy from copper substratesMEC CO LTD·Filed 1990·Granted Jul 30, 1991·39 cites·3 claims
- 0877US5700389AEtching solution for copper or copper alloyMEC CO LTD·Filed 1995·Granted Dec 23, 1997·43 cites·13 claims
- 0971US9011712B2Microetching solution for copper, replenishment solution therefor and method for production of wiring boardMEC CO LTD·Filed 2013·Granted Apr 21, 2015·2 cites·10 claims
- 1071US6746621B2Micro-etching composition for copper or copper alloy, micro-etching method, and method for manufacturing printed circuit boardMEC CO LTD·Filed 2001·Granted Jun 8, 2004·16 cites·10 claims
- 1171US5439783AComposition for treating copper or copper alloysMEC CO LTD·Filed 1994·Granted Aug 8, 1995·20 cites·7 claims
- 1269US7285229B2Etchant and replenishment solution therefor, and etching method and method for producing wiring board using the sameMEC CO LTD·Filed 2004·Granted Oct 23, 2007·10 cites·11 claims
- 1366US11053594B2Microetchant for copper and method for producing wiring boardMEC CO LTD·Filed 2020·Granted Jul 6, 2021·0 cites·20 claims
- 1465US6733886B2Laminate and method of manufacturing the sameMEC CO LTD·Filed 2002·Granted May 11, 2004·9 cites·14 claims
- 1565US5788830AElectroplating processMEC CO LTD·Filed 1996·Granted Aug 4, 1998·22 cites·6 claims
- 1665US5476947ABenzimidazole derivative and composition for treating copper and copper alloy surfaces comprising the sameMEC CO LTD·Filed 1994·Granted Dec 19, 1995·14 cites·2 claims
- 1764US2010029969A1Copper compound and method for producing copper thin film using the sameMEC CO LTD·Filed 2009·Application pending·0 cites
- 1862US12404287B2Chemical compound, surface treating agent, surface treating method, and production method for metal-resin compositeMEC CO LTD·Filed 2024·Granted Sep 2, 2025·0 cites·11 claims
- 1961US12157837B2Adhesive composition, method for producing surface-treated metal member, and method for producing metal-resin composite bodyMEC CO LTD·Filed 2020·Granted Dec 3, 2024·0 cites·10 claims
- 2061US2025381760A1Method for Producing Aluminum-Resin Composite, and Surface Treatment AgentMEC CO LTD·Filed 2023·Application pending·0 cites
- 2159US5547558AProcess for electroplating nonconductive surfaceMEC CO LTD·Filed 1995·Granted Aug 20, 1996·16 cites·1 claims
- 2258US11230644B1Coating film-forming composition, method for producing surface-treated metal member, and method for producing metal-resin compositeMEC CO LTD·Filed 2021·Granted Jan 25, 2022·0 cites·6 claims
- 2358US11208726B2Microetching agent for copper, copper surface roughening method and wiring board production methodMEC CO LTD·Filed 2018·Granted Dec 28, 2021·0 cites·2 claims
- 2457US10174428B2Etchant, replenishment solution and method for forming copper wiringMEC CO LTD·Filed 2016·Granted Jan 8, 2019·1 cites·9 claims
- 2557US2026043144A1Copper etchantMEC CO LTD·Filed 2023·Application pending·0 cites
- 2656US11937573B2Music providing system for non-human animalMEC CO LTD·Filed 2019·Granted Mar 26, 2024·0 cites·10 claims
- 2756US5885476AComposition for microetching copper or copper alloyMEC CO LTD·Filed 1997·Granted Mar 23, 1999·23 cites·8 claims
- 2856US2025207069A1Cleaning agent, cleaning method and supplementary liquidMEC CO LTD·Filed 2023·Application pending·0 cites
- 2955US2010000971A1Adhesive layer forming liquidMEC CO LTD·Filed 2009·Application pending·0 cites
- 3054US2008308964A1Method for forming film of silane coupling agentMEC CO LTD·Filed 2008·Application pending·0 cites
- 3153US2010108531A1Adhesive layer forming liquid and adhesive layer forming processMEC CO LTD·Filed 2009·Application pending·0 cites
- 3252US9441303B2Microetching solution for copper, replenishment solution therefor and method for production of wiring boardMEC CO LTD·Filed 2013·Granted Sep 13, 2016·0 cites·11 claims
- 3352US7029761B2Bonding layer for bonding resin on copper surfaceMEC CO LTD·Filed 2004·Granted Apr 18, 2006·5 cites·7 claims
- 3452US6106899AMethod for surface treatment of copper or copper alloysMEC CO LTD·Filed 1998·Granted Aug 22, 2000·17 cites·15 claims
- 3552US2021387255A1Copper powder for 3d printing, method for producing copper powder for 3d printing, method for producing 3d printed article, and 3d printed articleMEC CO LTD·Filed 2019·Application pending·0 cites
- 3652US2020109475A1Etching methodMEC CO LTD·Filed 2019·Application pending·0 cites
- 3751US10329453B2Film-forming composition, method for producing surface-treated metal member, and method for producing metal-resin compositeMEC CO LTD·Filed 2017·Granted Jun 25, 2019·0 cites·7 claims
- 3851US6220540B1Mechanism for retaining one tape deck in inoperative position in double cassette tape playerMEC CO LTD·Filed 2000·Granted Apr 24, 2001·2 cites·9 claims
- 3950US9932678B2Microetching solution for copper, replenishment solution therefor and method for production of wiring boardMEC CO LTD·Filed 2016·Granted Apr 3, 2018·0 cites·7 claims
- 4050US7431861B2Etchant, replenishment solution and method for producing copper wiring using the sameMEC CO LTD·Filed 2004·Granted Oct 7, 2008·8 cites·10 claims
- 4150US2019003062A1Microetchant for copper and method for producing wiring boardMEC CO LTD·Filed 2017·Application pending·0 cites
- 4249US12460303B2Etching agent and method for producing circuit boardMEC CO LTD·Filed 2021·Granted Nov 4, 2025·0 cites·17 claims
- 4348US5334261ASoldering flux composition and solder paste compositionMEC CO LTD·Filed 1993·Granted Aug 2, 1994·15 cites·7 claims
- 4448US2008011981A1Etchant and replenishment solution therefor, and etching method and method for producing wiring board using the sameMEC CO LTD·Filed 2007·Application pending·0 cites
- 4547US2007277736A1Method for manufacturing substrate, and vapor deposition apparatus used for the sameMEC CO LTD·Filed 2007·Application pending·0 cites
- 4646US2005003086A1Copper compound and method for producing copper thin film using the sameMEC CO LTD·Filed 2004·Application pending·0 cites
- 4745US2008073614A1Metal removing solution and metal removing method using the sameMEC CO LTD·Filed 2007·Application pending·0 cites
- 4844US10801112B2Composition for forming coating, production method for surface-treated metal member, and production method for metal-resin compositeMEC CO LTD·Filed 2017·Granted Oct 13, 2020·0 cites·14 claims
- 4943US10883027B2Film-forming composition, method for producing surface-treated metal member, and method for producing metal-resin compositeMEC CO LTD·Filed 2018·Granted Jan 5, 2021·0 cites·11 claims
- 5043US7156904B2Bonding layer forming solution, method of producing copper-to-resin bonding layer using the solution, and layered product obtained therebyMEC CO LTD·Filed 2004·Granted Jan 2, 2007·3 cites·18 claims
Showing the top 50 of 69 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when MEC CO LTD files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →