Assignee
SHEN YU-NUNG
TW·39 granted patents·13 pending applications·93 citations·filing 2001–2012
Top patents by PatentIndex Score
52 records- 0186US7682053B2Light-emitting device with a long lifespanSHEN YU-NUNG·Filed 2007·Granted Mar 23, 2010·12 cites·12 claims
- 0283US7926986B2Light-emitting device with a long lifespanSHEN YU-NUNG·Filed 2010·Granted Apr 19, 2011·6 cites·15 claims
- 0381US7576366B2Light-emitting diode chip package body and packaging method thereofSHEN YU-NUNG·Filed 2008·Granted Aug 18, 2009·6 cites·11 claims
- 0480US8684564B2Light-emitting diode illumination apparatusesSHEN YU-NUNG·Filed 2010·Granted Apr 1, 2014·8 cites·16 claims
- 0572US8405099B2Light-emitting diode die package and method for producing sameSHEN YU-NUNG·Filed 2012·Granted Mar 26, 2013·2 cites·2 claims
- 0671US8405114B2Light-emitting diode die package and method for producing sameSHEN YU-NUNG·Filed 2012·Granted Mar 26, 2013·2 cites·1 claims
- 0771US8242517B2Light-emitting diode die package and method for producing sameSHEN YU-NUNG·Filed 2010·Granted Aug 14, 2012·2 cites·7 claims
- 0871US8242690B2Light-emitting diode die packages and illumination apparatuses using sameSHEN YU-NUNG·Filed 2010·Granted Aug 14, 2012·2 cites·7 claims
- 0970US7635876B2LED package structure and method of packaging the sameSHEN YU-NUNG·Filed 2005·Granted Dec 22, 2009·4 cites·21 claims
- 1069US8337048B2Light source package having a six sided light emitting die supported by electrodesSHEN YU-NUNG·Filed 2009·Granted Dec 25, 2012·5 cites·8 claims
- 1169US8076775B2Semiconductor package and method for making the sameSHEN YU-NUNG·Filed 2009·Granted Dec 13, 2011·3 cites·7 claims
- 1267US7408370B2Lighting deviceSHEN YU-NUNG·Filed 2006·Granted Aug 5, 2008·3 cites·16 claims
- 1367US6577014B2Low-profile semiconductor deviceSHEN YU NUNG·Filed 2001·Granted Jun 10, 2003·13 cites·13 claims
- 1464US8624489B2Light-emitting diode die packages and illumination apparatuses using sameSHEN YU-NUNG·Filed 2012·Granted Jan 7, 2014·1 cites·6 claims
- 1564US7399996B2LED package and method for producing the sameSHEN YU-NUNG·Filed 2007·Granted Jul 15, 2008·1 cites·10 claims
- 1662US8253345B2Method for driving LEDSHEN YU-NUNG·Filed 2008·Granted Aug 28, 2012·1 cites·20 claims
- 1762US7672130B2Heat dissipating deviceSHEN YU-NUNG·Filed 2008·Granted Mar 2, 2010·2 cites·9 claims
- 1862US7339198B2Light-emitting diode chip package body and packaging method thereofSHEN YU-NUNG·Filed 2004·Granted Mar 4, 2008·6 cites·11 claims
- 1959US7411285B2Low profile stacked semiconductor chip packageSHEN YU-NUNG·Filed 2005·Granted Aug 12, 2008·1 cites·8 claims
- 2059US7383630B2Method for making a circuit plateSHEN YU-NUNG·Filed 2005·Granted Jun 10, 2008·1 cites·14 claims
- 2154US7520627B1Backlight moduleSHEN YU-NUNG·Filed 2007·Granted Apr 21, 2009·0 cites·7 claims
- 2254US7482637B2Led package and method for producing the sameSHEN YU-NUNG·Filed 2007·Granted Jan 27, 2009·0 cites·7 claims
- 2354US7456437B2LED package and method for producing the sameSHEN YU-NUNG·Filed 2007·Granted Nov 25, 2008·0 cites·18 claims
- 2454US7084499B2Semiconductor package and method for making the sameSHEN YU-NUNG·Filed 2003·Granted Aug 1, 2006·6 cites·14 claims
- 2554US2012153315A1Light emitting deviceSHEN YU-NUNG·Filed 2012·Application pending·0 cites
- 2654US2012161173A1Light emitting deviceSHEN YU-NUNG·Filed 2012·Application pending·0 cites
- 2754US2012161168A1Light emitting deviceSHEN YU-NUNG·Filed 2012·Application pending·0 cites
- 2853US8581490B2Light-emitting diode die packages and illumination apparatuses using sameSHEN YU-NUNG·Filed 2012·Granted Nov 12, 2013·0 cites·5 claims
- 2953US8017968B2Light-emitting diode chip package body and method for manufacturing sameSHEN YU-NUNG·Filed 2008·Granted Sep 13, 2011·0 cites·14 claims
- 3053US7858416B2LED package structure and method of packaging the sameSHEN YU-NUNG·Filed 2009·Granted Dec 28, 2010·0 cites·54 claims
- 3153US7236432B2Apparatus for reading a data storage mediumSHEN YU-NUNG·Filed 2003·Granted Jun 26, 2007·2 cites·32 claims
- 3252US2012170272A1Light source packageSHEN YU-NUNG·Filed 2012·Application pending·0 cites
- 3351US8487339B2Light-emitting diode chip package body and method for manufacturing sameSHEN YU-NUNG·Filed 2011·Granted Jul 16, 2013·0 cites·11 claims
- 3451US2008197365A1Light emitting deviceSHEN YU-NUNG·Filed 2008·Application pending·0 cites
- 3550US2005269585A1LED package and method for producing the sameSHEN YU-NUNG·Filed 2005·Application pending·0 cites
- 3649US7180184B2Conductive bump for semiconductor device and method for making the sameSHEN YU-NUNG·Filed 2003·Granted Feb 20, 2007·3 cites·2 claims
- 3749US2012068358A1Semiconductor package and method for making the sameSHEN YU-NUNG·Filed 2011·Application pending·0 cites
- 3849US2012061831A1Semiconductor package and method for making the sameSHEN YU-NUNG·Filed 2011·Application pending·0 cites
- 3948US7960741B2Light emitting diode with phosphor material and reflective layer and method for making sameSHEN YU-NUNG·Filed 2008·Granted Jun 14, 2011·0 cites·7 claims
- 4048US2008055911A1Light source device for a projectorSHEN YU-NUNG·Filed 2007·Application pending·0 cites
- 4148US2007258214A1Heat-Dissipating Device with Tapered FinsSHEN YU-NUNG·Filed 2007·Application pending·0 cites
- 4244US8939613B2Light-emitting diode die packages and methods for producingSHEN YU-NUNG·Filed 2012·Granted Jan 27, 2015·0 cites·21 claims
- 4344US7176573B2Semiconductor device with a multi-level interconnect structure and method for making the sameSHEN YU-NUNG·Filed 2003·Granted Feb 13, 2007·1 cites·20 claims
- 4442US8669569B2Light emitting diode package and method for fabricating the sameSHEN YU-NUNG·Filed 2011·Granted Mar 11, 2014·0 cites·12 claims
- 4541US8563963B2Light-emitting diode die packages and methods for producing sameSHEN YU-NUNG·Filed 2010·Granted Oct 22, 2013·0 cites·12 claims
- 4641US7307287B2LED package and method for producing the sameSHEN YU-NUNG·Filed 2005·Granted Dec 11, 2007·0 cites·10 claims
- 4741US2011073159A1Heat Dissipating Device and Module Using SameSHEN YU-NUNG·Filed 2010·Application pending·0 cites
- 4841US2012267649A1Light-emitting diode die packages and illumination apparatuses using sameSHEN YU-NUNG·Filed 2012·Application pending·0 cites
- 4939US8541793B2Light emitting diode device and method for fabricating the sameSHEN YU-NUNG·Filed 2011·Granted Sep 24, 2013·0 cites·20 claims
- 5038US7215017B2Wafer level package, wafer level packaging procedure for making wafer level packageSHEN YU-NUNG·Filed 2004·Granted May 8, 2007·0 cites·11 claims
Showing the top 50 of 52 patent records by PatentIndex Score.
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