Assignee
GEM SERVICES INC
US·45 granted patents·10 pending applications·483 citations·filing 2001–2012
Top patents by PatentIndex Score
55 records- 0193US8358017B2Semiconductor package featuring flip-chip die sandwiched between metal layersGEM SERVICES INC·Filed 2008·Granted Jan 22, 2013·29 cites·22 claims
- 0292US7382044B1Semiconductor device package diepad having features formed by electroplatingGEM SERVICES INC·Filed 2006·Granted Jun 3, 2008·24 cites·8 claims
- 0392USD465207SLeadframe matrix for a surface mount packageGEM SERVICES INC·Filed 2001·Granted Nov 5, 2002·50 cites·1 claims
- 0489US7057273B2Surface mount packageGEM SERVICES INC·Filed 2001·Granted Jun 6, 2006·47 cites·6 claims
- 0587US7838339B2Semiconductor device package having features formed by stampingGEM SERVICES INC·Filed 2008·Granted Nov 23, 2010·14 cites·19 claims
- 0686US7122406B1Semiconductor device package diepad having features formed by electroplatingGEM SERVICES INC·Filed 2004·Granted Oct 17, 2006·38 cites·10 claims
- 0782US7215012B2Space-efficient package for laterally conducting deviceGEM SERVICES INC·Filed 2003·Granted May 8, 2007·25 cites·6 claims
- 0876US7667309B2Space-efficient package for laterally conducting deviceGEM SERVICES INC·Filed 2008·Granted Feb 23, 2010·5 cites·7 claims
- 0976USD471165SSurface mount packageGEM SERVICES INC·Filed 2001·Granted Mar 4, 2003·21 cites·1 claims
- 1073US7691670B2Interconnection of lead frame to die utilizing flip chip processGEM SERVICES INC·Filed 2008·Granted Apr 6, 2010·5 cites·19 claims
- 1166USD588080S2021-8J matrix leadframeGEM SERVICES INC·Filed 2007·Granted Mar 10, 2009·16 cites·1 claims
- 1258USD484858SPortion of a matrix for surface mount package leadframeGEM SERVICES INC·Filed 2002·Granted Jan 6, 2004·10 cites·1 claims
- 1355USD492266SPortion of a matrix for surface mount package leadframeGEM SERVICES INC·Filed 2002·Granted Jun 29, 2004·9 cites·1 claims
- 1455USD484859SPortion of a matrix for surface mount package leadframeGEM SERVICES INC·Filed 2003·Granted Jan 6, 2004·9 cites·1 claims
- 1555USD484104SPortion of a matrix for surface mount package leadframeGEM SERVICES INC·Filed 2002·Granted Dec 23, 2003·9 cites·1 claims
- 1655USD483336SPortion of a matrix for surface mount package leadframeGEM SERVICES INC·Filed 2002·Granted Dec 9, 2003·9 cites·1 claims
- 1754USD588557S4040-28J matrix leadframeGEM SERVICES INC·Filed 2007·Granted Mar 17, 2009·10 cites·1 claims
- 1853USD488136SPortion of a matrix for surface mount package leadframeGEM SERVICES INC·Filed 2003·Granted Apr 6, 2004·8 cites·1 claims
- 1953USD487432SPortion of a matrix for surface mount package leadframeGEM SERVICES INC·Filed 2003·Granted Mar 9, 2004·8 cites·1 claims
- 2053USD487431SPortion of a matrix for surface mount package leadframeGEM SERVICES INC·Filed 2003·Granted Mar 9, 2004·8 cites·1 claims
- 2153USD485244SPortion of a matrix for surface mount package leadframeGEM SERVICES INC·Filed 2002·Granted Jan 13, 2004·8 cites·1 claims
- 2252US7485498B2Space-efficient package for laterally conducting deviceGEM SERVICES INC·Filed 2007·Granted Feb 3, 2009·0 cites·5 claims
- 2351US2008142936A1Semiconductor device package diepad having features formed by electroplatingGEM SERVICES INC·Filed 2008·Application pending·0 cites
- 2450USD485808SPortion of a matrix for surface mount package leadframeGEM SERVICES INC·Filed 2003·Granted Jan 27, 2004·7 cites·1 claims
- 2550USD484103SPortion of a matrix for surface mount package leadframeGEM SERVICES INC·Filed 2002·Granted Dec 23, 2003·7 cites·1 claims
- 2650USD483337SPortion of a matrix for surface mount package leadframeGEM SERVICES INC·Filed 2002·Granted Dec 9, 2003·7 cites·1 claims
- 2750USD462062SSurface mount packageGEM SERVICES INC·Filed 2001·Granted Aug 27, 2002·7 cites·1 claims
- 2850USD461172SSurface mount packageGEM SERVICES INC·Filed 2001·Granted Aug 6, 2002·7 cites·1 claims
- 2950US2007007640A1Surface mount packageGEM SERVICES INC·Filed 2006·Application pending·0 cites
- 3048USD494939SPortion of a matrix for surface mount package leadframeGEM SERVICES INC·Filed 2002·Granted Aug 24, 2004·6 cites·1 claims
- 3148USD491900SPortion of a matrix for surface mount package leadframeGEM SERVICES INC·Filed 2002·Granted Jun 22, 2004·6 cites·1 claims
- 3248USD486802SPortion of a matrix for surface mount package leadframeGEM SERVICES INC·Filed 2002·Granted Feb 17, 2004·6 cites·1 claims
- 3348USD467231SSurface mount packageGEM SERVICES INC·Filed 2001·Granted Dec 17, 2002·6 cites·1 claims
- 3448US2013105974A1Semiconductor package featuring flip-chip die sandwiched between metal layersGEM SERVICES INC·Filed 2012·Application pending·0 cites
- 3547USD513608SPortion of a matrix for surface mount package leadframeGEM SERVICES INC·Filed 2003·Granted Jan 17, 2006·6 cites·1 claims
- 3647USD505122SPortion of a matrix for surface mount package leadframeGEM SERVICES INC·Filed 2003·Granted May 17, 2005·6 cites·1 claims
- 3747USD505121SPortion of a matrix for surface mount package leadframeGEM SERVICES INC·Filed 2003·Granted May 17, 2005·6 cites·1 claims
- 3847USD485243SPortion of a matrix for surface mount package leadframeGEM SERVICES INC·Filed 2002·Granted Jan 13, 2004·6 cites·1 claims
- 3947USD461170SSurface mount packageGEM SERVICES INC·Filed 2001·Granted Aug 6, 2002·6 cites·1 claims
- 4047US2005145998A1Surface mount packageGEM SERVICES INC·Filed 2005·Application pending·0 cites
- 4146US2008135991A1Semiconductor device package featuring encapsulated leadframe with projecting bumps or ballsGEM SERVICES INC·Filed 2006·Application pending·0 cites
- 4245USD467884SSurface mount packageGEM SERVICES INC·Filed 2001·Granted Dec 31, 2002·5 cites·1 claims
- 4345USD467885SSurface mount packageGEM SERVICES INC·Filed 2001·Granted Dec 31, 2002·5 cites·1 claims
- 4445USD467560SSurface mount packageGEM SERVICES INC·Filed 2001·Granted Dec 24, 2002·5 cites·1 claims
- 4542USD461783SSurface mount packageGEM SERVICES INC·Filed 2001·Granted Aug 20, 2002·4 cites·1 claims
- 4641US2008111219A1Package designs for vertical conduction dieGEM SERVICES INC·Filed 2006·Application pending·0 cites
- 4739USD560623SQuad-24JW surface mount packageGEM SERVICES INC·Filed 2005·Granted Jan 29, 2008·4 cites·1 claims
- 4839USD461784SSurface mount packageGEM SERVICES INC·Filed 2001·Granted Aug 20, 2002·3 cites·1 claims
- 4939USD461459SSurface mount packageGEM SERVICES INC·Filed 2001·Granted Aug 13, 2002·3 cites·1 claims
- 5039US2013017652A1Method of manufacturing a semiconductor device package with a heatsinkGEM SERVICES INC·Filed 2012·Application pending·0 cites
Showing the top 50 of 55 patent records by PatentIndex Score.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →