Assignee
GUZEK JOHN S
US·4 granted patents·5 pending applications·72 citations·filing 2007–2015
Top patents by PatentIndex Score
9 records- 0197US8264849B2Mold compounds in improved embedded-die coreless substrates, and processes of forming sameGUZEK JOHN S·Filed 2010·Granted Sep 11, 2012·49 cites·29 claims
- 0289US8786066B2Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming sameGUZEK JOHN S·Filed 2010·Granted Jul 22, 2014·11 cites·36 claims
- 0388US8891246B2System-in-package using embedded-die coreless substrates, and processes of forming sameGUZEK JOHN S·Filed 2010·Granted Nov 18, 2014·10 cites·34 claims
- 0461US9999129B2Microelectronic device and method of manufacturing sameGUZEK JOHN S·Filed 2009·Granted Jun 12, 2018·2 cites·9 claims
- 0550US2014327149A1Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming sameGUZEK JOHN S·Filed 2014·Application pending·0 cites
- 0644US2009072382A1Microelectronic package and method of forming sameGUZEK JOHN S·Filed 2007·Application pending·0 cites
- 0744US2011318850A1Microelectronic package and method of manufacturing sameGUZEK JOHN S·Filed 2011·Application pending·0 cites
- 0844US2015342037A1Same layer microelectronic circuit patterning using hybrid laser projection patterning (lpp) and semi-additive patterning (sap)GUZEK JOHN S·Filed 2015·Application pending·0 cites
- 0937US2012112336A1Encapsulated die, microelectronic package containing same, and method of manufacturing said microelectronic packageGUZEK JOHN S·Filed 2010·Application pending·0 cites
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