Assignee
LIM GWANG-MAN
KR·3 granted patents·4 pending applications·2 citations·filing 2007–2012
Top patents by PatentIndex Score
7 records- 0163US8174861B2Memory module having high data processing rateLIM GWANG-MAN·Filed 2011·Granted May 8, 2012·2 cites·20 claims
- 0252US2008145971A1Semiconductor package, manufacturing method thereof and IC chipLIM GWANG-MAN·Filed 2008·Application pending·0 cites
- 0352US2008164596A1Semiconductor package, manufacturing method thereof and IC chipLIM GWANG-MAN·Filed 2008·Application pending·0 cites
- 0447US2010164088A1Semiconductor package, manufacturing method thereof and ic chipLIM GWANG-MAN·Filed 2010·Application pending·0 cites
- 0544US8625323B2Memory module having high data processing rateLIM GWANG-MAN·Filed 2012·Granted Jan 7, 2014·0 cites·17 claims
- 0641US2007252256A1Package-on-package structuresLIM GWANG-MAN·Filed 2007·Application pending·0 cites
- 0740US8493706B2Semiconductor module and data memory module having the sameLIM GWANG-MAN·Filed 2010·Granted Jul 23, 2013·0 cites·12 claims
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