Assignee
QMAT INC
US·4 granted patents·6 pending applications·14 citations·filing 2014–2018
Top patents by PatentIndex Score
10 records- 0189US10164144B2Bond and release layer transfer processQMAT INC·Filed 2017·Granted Dec 25, 2018·7 cites·17 claims
- 0284US9859458B2Bond and release layer transfer processQMAT INC·Filed 2016·Granted Jan 2, 2018·4 cites·26 claims
- 0373US10186630B2Seed wafer for GaN thickening using gas- or liquid-phase epitaxyQMAT INC·Filed 2017·Granted Jan 22, 2019·1 cites·23 claims
- 0472US10041187B2Techniques for forming optoelectronic devicesQMAT INC·Filed 2014·Granted Aug 7, 2018·2 cites·13 claims
- 0554US2019288158A1SEED WAFER FOR GaN THICKENING USING GAS- OR LIQUID-PHASE EPITAXYQMAT INC·Filed 2018·Application pending·0 cites
- 0654US2019103507A1Bond and release layer transfer processQMAT INC·Filed 2018·Application pending·0 cites
- 0752US2019024259A1Techniques for forming optoelectronic devicesQMAT INC·Filed 2018·Application pending·0 cites
- 0838US2018033609A1Removal of non-cleaved/non-transferred material from donor substrateQMAT INC·Filed 2017·Application pending·0 cites
- 0938US2018019169A1Backing substrate stabilizing donor substrate for implant or reclamationQMAT INC·Filed 2017·Application pending·0 cites
- 1038US2018138357A1Micro-light emitting diode (led) fabrication by layer transferQMAT INC·Filed 2017·Application pending·0 cites
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