Assignee
WEI SHIH-LONG
TW·4 granted patents·7 pending applications·3 citations·filing 2010–2015
Top patents by PatentIndex Score
11 records- 0165US8841172B2Method for forming package substrateWEI SHIH-LONG·Filed 2012·Granted Sep 23, 2014·2 cites·11 claims
- 0258US8591756B2Method of manufacturing a metallized ceramic substrateWEI SHIH-LONG·Filed 2011·Granted Nov 26, 2013·1 cites·11 claims
- 0344US2013082292A1Light Emitting Diode Packaging Structure and Method of Fabricating the SameWEI SHIH-LONG·Filed 2011·Application pending·0 cites
- 0443US2012211792A1Package Substrate and Method for Forming the SameWEI SHIH-LONG·Filed 2011·Application pending·0 cites
- 0542US2013089982A1Method of Fabricating a Substrate Having Conductive Through HolesWEI SHIH-LONG·Filed 2012·Application pending·0 cites
- 0641US2013313122A1Method For Fabricating Conductive Structures of SubstrateWEI SHIH-LONG·Filed 2012·Application pending·0 cites
- 0739US2013098867A1Method for Selective Metallization on a Ceramic SubstrateWEI SHIH-LONG·Filed 2011·Application pending·0 cites
- 0838US9508474B2Method for manufacturing anticorrosive thin film resistor and structure thereofWEI SHIH-LONG·Filed 2015·Granted Nov 29, 2016·0 cites·7 claims
- 0935US2012064230A1Method for forming conductive via in a substrateWEI SHIH-LONG·Filed 2010·Application pending·0 cites
- 1033US2012001212A1Light-Emitting Diode Packaging Structure and Substrate ThereforWEI SHIH-LONG·Filed 2010·Application pending·0 cites
- 1132US8590140B2Method for manufacturing alloy resistorWEI SHIH-LONG·Filed 2010·Granted Nov 26, 2013·0 cites·8 claims
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