Package Substrate and Method for Forming the Same

Abstract

A package substrate is disclosed. The package substrate includes a substrate body having a conductive portion, a plurality of insulation portions and two surfaces opposing to each other; and a plurality of bonding layers for heat dissipation formed on the two surfaces of the substrate body, conducted via the conductive portion and separated from one another by the insulation portions. A method for forming the package substrate is also disclosed.

1 . A package substrate, comprising:
 a substrate body having a conductive portion, a plurality of insulation portions and two surfaces opposing to each other; and   a plurality of bonding layers for heat dissipation formed on the two surfaces of the substrate body, conducted via the conductive portion and separated from one another by the insulation portions.   
     
     
         2 . The package substrate of  claim 1 , wherein the conductive portion is made of copper or aluminum. 
     
     
         3 . The package substrate of  claim 1 , wherein the insulation portions are made of polymer or ceramics. 
     
     
         4 . The package substrate of  claim 1 , wherein the insulation portions are arranged alternately for dividing the substrate body into a plurality of regions. 
     
     
         5 . The package substrate of  claim 1 , wherein a volume of the conductive portion is larger than a volume of the insulation portion. 
     
     
         6 . The package substrate of  claim 1 , wherein the bonding layer has a pad for attaching a light emitting diode. 
     
     
         7 . The package substrate of  claim 1 , wherein the light emitting diode is electrically connected to the bonding layer. 
     
     
         8 . A method for forming a package substrate, comprising the steps of:
 providing a metal plate having a first surface and a second surface opposing to the first surface;   forming a plurality of trenches on the first surface of the metal plate;   providing insulation material in the trenches;   removing metal plate material under the second surface of the metal plate, and exposing the insulation material in the trenches from the first and second surfaces of the substrate body to form a substrate body having two surfaces opposing to each other, wherein the substrate body includes a conductive portion made of the metal plate, and an insulation portion made of the insulation material; and   forming a plurality of bonding layers on the two surfaces of the substrate body, wherein the bonding layers are conducted via the conductive portion for heat dissipation, and separated from one another by the insulation portion.   
     
     
         9 . The method of  claim 8 , wherein the metal plate is made of copper or aluminum. 
     
     
         10 . The method of  claim 8 , wherein the trenches are arranged alternately for dividing the first surface of the metal plate into a plurality of regions. 
     
     
         11 . The method of  claim 8 , wherein the insulation portion is made of polymer or ceramics. 
     
     
         12 . The method of  claim 8 , wherein the insulation portion is formed by the steps of:
 forming the insulation material on the first surface of the metal plate and in the trenches; and   removing a portion of the insulation material on the first surface of the metal plate and remaining the insulation material in the trenches.   
     
     
         13 . The method of  claim 8 , wherein a volume of the conductive portion is larger than a volume of the insulation portion. 
     
     
         14 . The method of  claim 8 , wherein the bonding layer has a pad for attaching a light emitting diode. 
     
     
         15 . A method for forming a package substrate, comprising the steps of:
 providing an insulation plate;   forming a plurality hollow regions through the insulation plate;   providing metal material in the hollow regions to form a substrate body with two surfaces opposing to each other, wherein the substrate body includes a conductive portion made of the metal material, and an insulation portion made of the insulation plate with hollow regions; and   forming a plurality of bonding layers on the two surfaces of the substrate body, wherein the bonding layers are conducted via the conductive portion for heat dissipation, and separated from one another by the insulation portion.   
     
     
         16 . The method of  claim 15 , wherein the metal material is copper or aluminum. 
     
     
         17 . The method of  claim 15 , wherein the hollow regions are arranged alternately to form a plurality of isolated regions. 
     
     
         18 . The method of  claim 15 , wherein the insulation portion is made of polymer or ceramics. 
     
     
         19 . The method of  claim 15 , wherein a volume of the conductive portion is larger than a volume of the insulation portion. 
     
     
         20 . The method of  claim 1 , wherein the bonding layer has a pad for attaching a light emitting diode.