Inventor · disambiguated record
Chien-Hung Ho
Also filed as: HO CHIEN-HUNG
22 granted patents·13 pending applications·380 citations·filing 2001–2023
95Inventor score
Files withEMEMORY TECHNOLOGY INC12WEI SHIH-LONG10VIKING TECH CORP7LOTES CO LTD4INSTR TECHNOLOGY RES CT1
Top patents by PatentIndex Score
35 records- 0195US6952129B2Four-phase dual pumping circuitEMEMORY TECHNOLOGY INC·Filed 2004·Granted Oct 4, 2005·142 cites·16 claims
- 0294US6809603B1Ring oscillator having a stable output signal without influence of MOS devicesEMEMORY TECHNOLOGY INC·Filed 2003·Granted Oct 26, 2004·66 cites·22 claims
- 0387US6958597B1Voltage generating apparatus with a fine-tune current moduleEMEMORY TECHNOLOGY INC·Filed 2004·Granted Oct 25, 2005·38 cites·16 claims
- 0483US10050387B1Method for manufacturing shielded connectorLOTES CO LTD·Filed 2018·Granted Aug 14, 2018·6 cites·19 claims
- 0577US9837592B2Ceramic substrate and semiconductor package having the sameVIKING TECH CORP·Filed 2014·Granted Dec 5, 2017·7 cites·8 claims
- 0673US6642773B2Charge pump circuit without body effectsEMEMORY TECHNOLOGY INC·Filed 2002·Granted Nov 4, 2003·32 cites·12 claims
- 0769US6888400B2Charge pump circuit without body effectsEMEMORY TECHNOLOGY INC·Filed 2003·Granted May 3, 2005·26 cites·6 claims
- 0866US6580658B1Method using a word line driver for driving a word lineEMEMORY TECHNOLOGY INC·Filed 2002·Granted Jun 17, 2003·15 cites·14 claims
- 0965US8841172B2Method for forming package substrateWEI SHIH-LONG·Filed 2012·Granted Sep 23, 2014·2 cites·11 claims
- 1064US6819620B2Power supply device with reduced power consumptionEMEMORY TECHNOLOGY INC·Filed 2003·Granted Nov 16, 2004·13 cites·7 claims
- 1163US6483366B2Breakdown-free negative level shifterEMEMORY TECHNOLOGY INC·Filed 2001·Granted Nov 19, 2002·11 cites·13 claims
- 1259US9373430B2Resistor componentVIKING TECH CORP·Filed 2013·Granted Jun 21, 2016·1 cites·7 claims
- 1358US8591756B2Method of manufacturing a metallized ceramic substrateWEI SHIH-LONG·Filed 2011·Granted Nov 26, 2013·1 cites·11 claims
- 1458US7020036B2Memory unit with sensing current stabilizationEMEMORY TECHNOLOGY INC·Filed 2004·Granted Mar 28, 2006·9 cites·6 claims
- 1556US11564319B2Method of manufacturing curved-surface metal lineLOTES CO LTD·Filed 2020·Granted Jan 24, 2023·0 cites·12 claims
- 1655US6580645B1Page buffer of a flash memoryEMEMORY TECHNOLOGY INC·Filed 2002·Granted Jun 17, 2003·9 cites·16 claims
- 1753US12489253B2Electrical connectorLOTES CO LTD·Filed 2023·Granted Dec 2, 2025·0 cites·15 claims
- 1851US2006147741A1Composite plate device for thermal transpiration micropumpINSTR TECHNOLOGY RES CT·Filed 2005·Application pending·0 cites
- 1950US2020059146A1Electromagnetic actuatorLOTES CO LTD·Filed 2019·Application pending·0 cites
- 2049US2014027051A1Method of Fabricating a Light Emitting Diode Packaging StructureVIKING TECH CORP·Filed 2013·Application pending·0 cites
- 2148US9204555B2Method of electroplating and depositing metalVIKING TECH CORP·Filed 2012·Granted Dec 1, 2015·0 cites·10 claims
- 2247US2014170848A1Method of Forming SubstrateVIKING TECH CORP·Filed 2013·Application pending·0 cites
- 2345US9768092B2Carrier package and carrier with plural heat conductorsVIKING TECH CORP·Filed 2014·Granted Sep 19, 2017·0 cites·18 claims
- 2444US2013082292A1Light Emitting Diode Packaging Structure and Method of Fabricating the SameWEI SHIH-LONG·Filed 2011·Application pending·0 cites
- 2543US2012211792A1Package Substrate and Method for Forming the SameWEI SHIH-LONG·Filed 2011·Application pending·0 cites
- 2642US2013089982A1Method of Fabricating a Substrate Having Conductive Through HolesWEI SHIH-LONG·Filed 2012·Application pending·0 cites
- 2741US2013313122A1Method For Fabricating Conductive Structures of SubstrateWEI SHIH-LONG·Filed 2012·Application pending·0 cites
- 2840US6747905B1Voltage recovery switchEMEMORY TECHNOLOGY INC·Filed 2003·Granted Jun 8, 2004·2 cites·18 claims
- 2939US2013098867A1Method for Selective Metallization on a Ceramic SubstrateWEI SHIH-LONG·Filed 2011·Application pending·0 cites
- 3037US9437549B2Method for manufacturing ceramic substrateVIKING TECH CORP·Filed 2015·Granted Sep 6, 2016·0 cites·6 claims
- 3135US2012064230A1Method for forming conductive via in a substrateWEI SHIH-LONG·Filed 2010·Application pending·0 cites
- 3234US2008205115A1Apparatus and method for trimming integrated circuitEMEMORY TECHNOLOGY INC·Filed 2007·Application pending·0 cites
- 3333US2012001212A1Light-Emitting Diode Packaging Structure and Substrate ThereforWEI SHIH-LONG·Filed 2010·Application pending·0 cites
- 3432US8590140B2Method for manufacturing alloy resistorWEI SHIH-LONG·Filed 2010·Granted Nov 26, 2013·0 cites·8 claims
- 3532US2004129954A1Embedded nonvolatile memory having metal contact padsFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →