Method for Selective Metallization on a Ceramic Substrate

Abstract

A method of selective metallization on a ceramic substrate includes selectively forming an active brazing material on a predetermined area of a surface of a ceramic substrate, attaching the metal layer to the ceramic substrate with the active brazing material, performing a brazing process on the active brazing material, forming an etching stop layer on the metal layer and performing an etching process, and removing the etching stop layer. The method can be applied to a severe environment, and the conchoidal fracture between the ceramic substrate and the metal layer can also be avoided. The present invention not only simplifies the process but also improves the product yield.

What is claimed is: 
     
         1 . A method of selective metallization on a ceramic substrate, comprising:
 forming an active brazing material on a predetermined area of a surface of the ceramic substrate;   attaching a metal layer to the surface of the ceramic substrate with the active brazing material, and performing a brazing process on the active brazing material;   forming an etching stop layer on the predetermined area of the metal layer and etching the metal layer; and   removing the etching stop layer.   
     
     
         2 . The method of  claim 1 , wherein the active brazing material is nickel-based brazing material or silver-based brazing material. 
     
     
         3 . The method of  claim 1 , wherein the active brazing material has an active metal with a specific proportion. 
     
     
         4 . The method of  claim 1 , wherein the active brazing material is formed on the surface of the ceramic substrate by printing, spray coating, or lamination. 
     
     
         5 . The method of  claim 1 , wherein the etching stop layer corresponds in position to the active brazing material on the surface of the ceramic substrate. 
     
     
         6 . The method of  claim 1 , wherein the metal layer is copper, aluminum or stainless steel. 
     
     
         7 . A method of selective metallization on a ceramic substrate, comprising:
 performing a predetermined depth etching on a predetermined area of a metal layer, so as for forming an etching area and a reserved area on the metal layer;   forming an active brazing material on the reserved area of the metal layer;   attaching the metal layer with the active brazing material to the ceramic substrate, and performing a brazing process on the active brazing material; and   etching the metal layer for removing the etching area of the metal layer.   
     
     
         8 . The method of  claim 7 , wherein the active brazing material is nickel-based brazing material or silver-based brazing material. 
     
     
         9 . The method of  claim 7 , wherein the active brazing material has an active metal with a specific proportion. 
     
     
         10 . The method of  claim 7 , wherein the active brazing material is formed on the metal layer by printing, spray coating, or lamination. 
     
     
         11 . The method of  claim 7 , wherein the metal layer is copper, aluminum or stainless steel.