Inventor · disambiguated record
Shen-Li Hsiao
Also filed as: HSIAO SHEN-LI
17 granted patents·18 pending applications·6 citations·filing 2007–2024
86Inventor score
Top patents by PatentIndex Score
35 records- 0191US11521767B2Ignition resistor and method for manufacturing the sameYAGEO CORP·Filed 2021·Granted Dec 6, 2022·2 cites·13 claims
- 0272US12308147B2Thermistor paste and manufacturing method thereofYAGEO CORP·Filed 2023·Granted May 20, 2025·0 cites·9 claims
- 0368US11935675B2Anti-surge resistor and fabrication method thereofYAGEO CORP·Filed 2022·Granted Mar 19, 2024·0 cites·15 claims
- 0465US8841172B2Method for forming package substrateWEI SHIH-LONG·Filed 2012·Granted Sep 23, 2014·2 cites·11 claims
- 0562US12340926B2High-power resistor and fabrication method thereofYAGEO CORP·Filed 2022·Granted Jun 24, 2025·0 cites·9 claims
- 0661US2025149212A1High-power chip resistor and manufacturing method thereofYAGEO CORP·Filed 2024·Application pending·0 cites
- 0760US12191055B2Method for fabricating a micro resistance layer and method for fabricating a micro resistorYAGEO CORP·Filed 2022·Granted Jan 7, 2025·0 cites·15 claims
- 0859US9373430B2Resistor componentVIKING TECH CORP·Filed 2013·Granted Jun 21, 2016·1 cites·7 claims
- 0958US12216142B2Current sensing resistors and method of manufacturing the sameYAGEO CORP·Filed 2022·Granted Feb 4, 2025·0 cites·14 claims
- 1058US11875924B2Method of fabricating resistor in igniterYAGEO CORP·Filed 2022·Granted Jan 16, 2024·0 cites·18 claims
- 1158US8591756B2Method of manufacturing a metallized ceramic substrateWEI SHIH-LONG·Filed 2011·Granted Nov 26, 2013·1 cites·11 claims
- 1258US2025029754A1Printing chip resistor and method for producing the sameYAGEO CORP·Filed 2023·Application pending·0 cites
- 1355US2025253075A1Thin film resistor and method of fabricating the sameYAGEO CORP·Filed 2024·Application pending·0 cites
- 1455US2025253076A1Resistor and manufacturing method thereofYAGEO CORP·Filed 2024·Application pending·0 cites
- 1555US2025266191A1Thin film resistor and method of fabricating the sameYAGEO CORP·Filed 2024·Application pending·0 cites
- 1654US2025149211A1Chip resistorYAGEO CORP·Filed 2023·Application pending·0 cites
- 1753US2025046497A1Thermal resistor and manufacturing method thereofYAGEO CORP·Filed 2023·Application pending·0 cites
- 1853US2025140450A1Chip resistorYAGEO CORP·Filed 2023·Application pending·0 cites
- 1952US2025149210A1High-power thin film resistor and method of manufacturing thereofYAGEO CORP·Filed 2024·Application pending·0 cites
- 2051US12469646B2Thin-film chip resistor-capacitor for miniaturization and thinningYAGEO CORP·Filed 2022·Granted Nov 11, 2025·0 cites·11 claims
- 2150US11569053B2Fuse resistor and method for manufacturing the sameYAGEO CORP·Filed 2021·Granted Jan 31, 2023·0 cites·5 claims
- 2250US10839991B2Method for manufacturing shunt resistorYAGEO CORP·Filed 2018·Granted Nov 17, 2020·0 cites·9 claims
- 2349US2022223325A1Method for manufacturing resistorYAGEO CORP·Filed 2021·Application pending·0 cites
- 2449US2014027051A1Method of Fabricating a Light Emitting Diode Packaging StructureVIKING TECH CORP·Filed 2013·Application pending·0 cites
- 2548US9204555B2Method of electroplating and depositing metalVIKING TECH CORP·Filed 2012·Granted Dec 1, 2015·0 cites·10 claims
- 2647US2014170848A1Method of Forming SubstrateVIKING TECH CORP·Filed 2013·Application pending·0 cites
- 2744US2013082292A1Light Emitting Diode Packaging Structure and Method of Fabricating the SameWEI SHIH-LONG·Filed 2011·Application pending·0 cites
- 2843US2012211792A1Package Substrate and Method for Forming the SameWEI SHIH-LONG·Filed 2011·Application pending·0 cites
- 2942US2013089982A1Method of Fabricating a Substrate Having Conductive Through HolesWEI SHIH-LONG·Filed 2012·Application pending·0 cites
- 3041US10818418B2Method for manufacturing shunt resistorYAGEO CORP·Filed 2018·Granted Oct 27, 2020·0 cites·10 claims
- 3141US2013313122A1Method For Fabricating Conductive Structures of SubstrateWEI SHIH-LONG·Filed 2012·Application pending·0 cites
- 3239US7640652B2Method of making a current sensing chip resistorVIKING TECH CORP·Filed 2007·Granted Jan 5, 2010·0 cites·1 claims
- 3339US2013098867A1Method for Selective Metallization on a Ceramic SubstrateWEI SHIH-LONG·Filed 2011·Application pending·0 cites
- 3433US2012001212A1Light-Emitting Diode Packaging Structure and Substrate ThereforWEI SHIH-LONG·Filed 2010·Application pending·0 cites
- 3532US8590140B2Method for manufacturing alloy resistorWEI SHIH-LONG·Filed 2010·Granted Nov 26, 2013·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →