Method For Fabricating Conductive Structures of Substrate

Abstract

A method for fabricating a conductive structure of a substrate includes the steps of: providing an insulating substrate having opposite first and second surfaces and forming an insulating adhesive film on the second surface of the insulating substrate; forming at least a through hole penetrating the insulating substrate and the insulating adhesive film and forming a conductive foil on the insulating adhesive film so as to cover the through hole; and forming a shielding material on the conductive foil and the second surface of the insulating substrate and performing an electrochemical deposition process through the conductive foil so as to fill the through hole with a conductive material along a direction towards the first surface of the insulating substrate, thereby preventing the formation of voids in the through hole and hence reducing the overall resistance and preventing a blister effect from occurring.

What is claimed is: 
     
         1 . A method for fabricating a conductive structure of a substrate, comprising the steps of:
 providing an insulating substrate having opposite first and second surfaces and forming an insulating adhesive film on the second surface of the insulating substrate;   forming at least a through hole penetrating the insulating substrate and the insulating adhesive film and forming a conductive foil on the insulating adhesive film so as to cover the through hole; and   forming a shielding material on the conductive foil and the second surface of the insulating substrate and performing an electrochemical deposition process through the conductive foil so as to fill the through hole with a conductive material along a direction towards the first surface of the insulating substrate.   
     
     
         2 . The method of  claim 1 , further comprising removing the shielding material, the conductive foil and the insulating adhesive film and planarizing the first and second surfaces of the insulating substrate so as for the conductive material to be flush with the first and second surfaces of the insulating substrate. 
     
     
         3 . The method of  claim 2 , further comprising forming circuit layers on the first and second surfaces of the insulating substrate, respectively, the circuit layers being electrically connected through the conductive material. 
     
     
         4 . The method of  claim 1 , wherein filling the through hole with the conductive material comprises isotropically and uniformly depositing the conductive material in the through hole from the conductive foil to the first surface. 
     
     
         5 . The method of  claim 1 , wherein the insulating substrate is an aluminum nitride substrate or an aluminum oxide substrate. 
     
     
         6 . The method of  claim 1 , wherein the insulating adhesive film is an acid-resistant acrylic thermosetting adhesive film. 
     
     
         7 . The method of  claim 1 , wherein the conductive foil is made of copper. 
     
     
         8 . The method of  claim 1 , wherein the shielding material is an anti-plating adhesive tape or a gasket. 
     
     
         9 . The method of  claim 1 , wherein the conductive material is made of copper. 
     
     
         10 . The method of  claim 1 , wherein the through hole has a diameter greater than 300 um.