Inventor

KIM JI-HWANG

KR44 patents

⚠️ This page may combine multiple inventors who share the name “KIM JI-HWANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KIM JI-HWANG

SAMSUNG ELECTRONICS CO LTD

Semiconductor packages, methods of manufacturing the same, and semiconductor package structures including the same

Semiconductor package including a rewiring layer with an embedded chip

Semiconductor package

Semiconductor package and method of manufacturing the same

Semiconductor package including a rewiring layer with an embedded chip

Printed circuit board and semiconductor package including the same

Methods of manufacturing semiconductor packages

Semiconductor package and method of manufacturing the semiconductor package

Method of fabricating semiconductor device including a substrate attached to a carrier

Semiconductor package

Image sensor package

Semiconductor package including a redistribution line

Image sensor

Image sensor package

Semiconductor chip module including a channel for controlling warpage and method of manufacturing the same

Semiconductor package including an interposer and method of fabricating the same

Semiconductor package including an in interposer and method of fabricating the same

Substrate structures for image sensor modules and image sensor modules including the same

Method of manufacturing semiconductor device

Semiconductor devices including a lower semiconductor package, an upper semiconductor package on the lower semiconductor package, and a connection pattern between the lower semiconductor package and the upper semiconductor package

Semiconductor devices including a lower semiconductor package, an upper semiconductor package on the lower semiconductor package, and a connection pattern between the lower semiconductor package and the upper semiconductor package

Semiconductor packages including a lower structure, an upper structure on the lower structure, and a connection pattern between the lower structure and the upper structure

Semiconductor package

Image sensor package

Semiconductor package including an interposer and method of fabricating the same

Semiconductor package and method of fabricating the same

Semiconductor package

Semiconductor package and method of fabricating the same

Semiconductor package with connection substrate and method of manufacturing the same

Semiconductor package having second pad electrically connected through the interposer chip to the first pad

Semiconductor package including a redistribution line

Semiconductor packages having TSV and adhesive layer

Semiconductor package

Semiconductor package and method of fabricating the same

Method of fabricating a packaged integrated circuit with through-silicon via an inner substrate

Semiconductor package and method of fabricating the same

Semiconductor package device

Semiconductor package and manufacturing method thereof

JUNG DEOK-YOUNG

Semiconductor packages, methods of manufacturing the same, and semiconductor package structures including the same

Semiconductor packages, methods of manufacturing the same, and semiconductor package structures including the same

KIM TAE-HYEONG

Semiconductor devices and package substrates having pillars and semiconductor packages and package stack structures having the same

SEO SUNKYOUNG

Semiconductor package and electronic device having heat dissipation pattern and/or heat conducting line

KO YEONG KWON

Alignment mark for semiconductor device

KIM JI HWANG

Semiconductor device and method of manufacturing the same