Inventor · disambiguated record
Kwang-Wook Lee
Also filed as: LEE KWANG WOOK
25 granted patents·11 pending applications·521 citations·filing 1998–2024
95Inventor score
Top patents by PatentIndex Score
36 records- 0196US7488688B2Method of removing oxide layer and semiconductor manufacturing apparatus for removing oxide layerSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Feb 10, 2009·250 cites·19 claims
- 0292US7053435B2Electronic devices including electrodes with insulating spacers thereonSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted May 30, 2006·57 cites·5 claims
- 0386US8604550B2Semiconductor devices including gate structure and method of fabricating the sameLEE KWANG-WOOK·Filed 2011·Granted Dec 10, 2013·10 cites·18 claims
- 0484US7314795B2Methods of forming electronic devices including electrodes with insulating spacers thereonSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jan 1, 2008·8 cites·39 claims
- 0583US10373973B2Method of manufacturing semiconductor device through by-product removal from conductive layerSK HYNIX INC·Filed 2018·Granted Aug 6, 2019·3 cites·19 claims
- 0683US6889447B2Method for drying a wafer and apparatus for performing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted May 10, 2005·29 cites·20 claims
- 0781US6399552B1Aqueous cleaning solution for removing contaminants surface of circuit substrate cleaning method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted Jun 4, 2002·40 cites·13 claims
- 0879US9136135B2Method of fabricating semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Sep 15, 2015·4 cites·12 claims
- 0978US6393003B1Semi-soft handoff method that uses multiple common frequencySAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted May 21, 2002·69 cites·23 claims
- 1078US6310923B1Device and method for data encoding and frequency diversity in mobile communications systemSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Oct 30, 2001·30 cites·10 claims
- 1174US10438891B2Integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Oct 8, 2019·2 cites·17 claims
- 1274US8748254B2Method of manufacturing semiconductor deviceLEE KWANG-WOOK·Filed 2012·Granted Jun 10, 2014·4 cites·19 claims
- 1372US11935926B2Semiconductor device and method for fabricating the sameSK HYNIX INC·Filed 2023·Granted Mar 19, 2024·0 cites·17 claims
- 1469US6875706B2Cleaning solution and method of cleaning a semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Apr 5, 2005·10 cites·15 claims
- 1565US7781346B2Methods of forming patterns and capacitors for semiconductor devices using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Aug 24, 2010·2 cites·10 claims
- 1661US11588026B2Semiconductor device and method for fabricating the sameSK HYNIX INC·Filed 2020·Granted Feb 21, 2023·0 cites·18 claims
- 1761US7888725B2Electronic devices including electrode walls with insulating layers thereonSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Feb 15, 2011·1 cites·17 claims
- 1860US2025218822A1Apparatus and method of processing substrateSEMES CO LTD·Filed 2024·Application pending·0 cites
- 1959US10714499B2Method of manufacturing semiconductor deviceSK HYNIX INC·Filed 2019·Granted Jul 14, 2020·0 cites·10 claims
- 2052US7491601B2Methods of forming electronic devices including electrodes with insulating spacers thereonSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Feb 17, 2009·0 cites·22 claims
- 2148US2008214006A1Methods of using corrosion-inhibiting cleaning compositions for metal layers and patterns on semiconductor substratesLEE KWANG-WOOK·Filed 2008·Application pending·0 cites
- 2248US2006287208A1Methods of Forming Corrosion-Inhibiting Cleaning Compositions for Metal Layers and Patterns on Semiconductor SubstratesSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 2347US6837943B2Method and apparatus for cleaning a semiconductor substrateSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Jan 4, 2005·1 cites·29 claims
- 2447US2005139233A1Cleaning solution and method of cleaning a semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Application pending·0 cites
- 2545US10922692B2Method for calculating confirmation reliability for blockchain based transaction and blockchain network monitoring system for performing the methodSAMSUNG SDS CO LTD·Filed 2018·Granted Feb 16, 2021·0 cites·14 claims
- 2645US2008220375A1Methods of reworking a semiconductor substrate and methods of forming a pattern in a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 2743US10818522B2Process chamber for a supercritical process and apparatus for treating substrates having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Oct 27, 2020·0 cites·17 claims
- 2843US7361547B2Method for forming a capacitor for use in a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Apr 22, 2008·1 cites·16 claims
- 2943US7135413B2Cleaning solution for removing damaged portion of ferroelectric layer and cleaning method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Nov 14, 2006·0 cites·24 claims
- 3043US2005261151A1Corrosion-inhibiting cleaning compositions for metal layers and patterns on semiconductor substratesLEE KWANG-WOOK·Filed 2005·Application pending·0 cites
- 3141US8086763B2Changing class of deviceCHOI MOO-RAK·Filed 2009·Granted Dec 27, 2011·0 cites·21 claims
- 3241US2006292817A1Methods of processing semiconductor structures and methods of forming capacitors for semiconductor devices using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 3340US2006263971A1Semiconductor device and method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 3439US2002003123A1Cleaning solution for removing damaged portion of ferroelectric layer and cleaning method using the sameFiled 2001·Application pending·0 cites
- 3539US2005176604A1Corrosion-inhibiting cleaning compositions for metal layers and patterns on semiconductor substratesFiled 2004·Application pending·0 cites
- 3638US2004163668A1Method of cleaning a substrateSAMSUNG ELECTRONICS CO LTD·Filed 2004·Application pending·0 cites
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