Inventor
LEE DAE-SEONG
KR29 patents
⚠️ This page may combine multiple inventors who share the name “LEE DAE-SEONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
23 patentsUS10291212B2May 14, 2019
Master-slave flip flop
SAMSUNG ELECTRONICS CO LTD5 citations84
US10587249B2Mar 10, 2020
Master-slave flip flop
SAMSUNG ELECTRONICS CO LTD2 citations73
US10062697B2Aug 28, 2018
Semiconductor device without a break region
SAMSUNG ELECTRONICS CO LTD3 citations73
US11189640B2Nov 30, 2021
Integrated circuit including asymmetric ending cells and system-on-chip including the same
SAMSUNG ELECTRONICS CO LTD2 citations72
US10957683B2Mar 23, 2021
Integrated circuit including multi-height standard cell and method of designing the same
SAMSUNG ELECTRONICS CO LTD2 citations72
US10911032B2Feb 2, 2021
Flip-flop
SAMSUNG ELECTRONICS CO LTD2 citations72
US10680014B2Jun 9, 2020
Integrated circuit including asymmetric ending cells and system-on-chip including the same
SAMSUNG ELECTRONICS CO LTD2 citations72
US10396761B2Aug 27, 2019
Flip-flop
SAMSUNG ELECTRONICS CO LTD5 citations72
US11126781B2Sep 21, 2021
Integrated circuit including standard cell and method and system for designing and manufacturing the same
SAMSUNG ELECTRONICS CO LTD3 citations67
US12453177B2Oct 21, 2025
Integrated circuit including asymmetric ending cells and system-on-chip including the same
SAMSUNG ELECTRONICS CO LTD0 citations62
USRE50503EJul 22, 2025
Master-slave flip flop
SAMSUNG ELECTRONICS CO LTD0 citations62
US11842999B2Dec 12, 2023
Semiconductor device without a break region
SAMSUNG ELECTRONICS CO LTD0 citations62
US11302694B2Apr 12, 2022
Semiconductor device without a break region
SAMSUNG ELECTRONICS CO LTD0 citations62
US10523188B2Dec 31, 2019
Semiconductor device
SAMSUNG ELECTRONICS CO LTD1 citations62
US10353000B2Jul 16, 2019
Multi-bit flip-flops
SAMSUNG ELECTRONICS CO LTD1 citations61
US11869884B2Jan 9, 2024
Semiconductor devices, methods of designing layouts of semiconductor devices and methods of fabricating semiconductor devices
SAMSUNG ELECTRONICS CO LTD0 citations59
US11239227B2Feb 1, 2022
Semiconductor devices, methods of designing layouts of semiconductor devices and methods of fabricating semiconductor devices
SAMSUNG ELECTRONICS CO LTD0 citations59
US12272694B2Apr 8, 2025
Semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations52
US10553585B2Feb 4, 2020
Semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations52
US10184984B2Jan 22, 2019
Integrated circuit and electronic apparatus including integrated circuit
SAMSUNG ELECTRONICS CO LTD0 citations51
US9537470B2Jan 3, 2017
Semiconductor device and method for operating the same
SAMSUNG ELECTRONICS CO LTD1 citations49
US9130550B2Sep 8, 2015
Semiconductor device and method for operating the same
SAMSUNG ELECTRONICS CO LTD1 citations49
US10673420B2Jun 2, 2020
Electronic circuit including flip-flop using common clock
SAMSUNG ELECTRONICS CO LTD0 citations40
WONIK IPS CO LTD
4 patentsUS12024777B2Jul 2, 2024
Method of processing substrate
WONIK IPS CO LTD0 citations46
US11965244B2Apr 23, 2024
Substrate processing method, substrate processing apparatus using the same, and semiconductor device manufacturing method
WONIK IPS CO LTD0 citations46
US12371783B2Jul 29, 2025
Internal chamber processing method and substrate processing method
WONIK IPS CO LTD0 citations44
US12027371B2Jul 2, 2024
Substrate processing method
WONIK IPS CO LTD0 citations42