Inventor · disambiguated record
David N. Walter
Also filed as: WALTER DAVID · WALTER DAVID N
12 granted patents·5 pending applications·1,061 citations·filing 1992–2013
94Inventor score
Top patents by PatentIndex Score
17 records- 0197US6707124B2HID land grid array packaged device having electrical and optical interconnectsTEXAS INSTRUMENTS INC·Filed 2001·Granted Mar 16, 2004·199 cites·25 claims
- 0296US7944034B2Array molded package-on-package having redistribution linesTEXAS INSTRUMENTS INC·Filed 2007·Granted May 17, 2011·50 cites·14 claims
- 0395US5432677AMulti-chip integrated circuit moduleTEXAS INSTRUMENTS INC·Filed 1994·Granted Jul 11, 1995·271 cites·21 claims
- 0493US6400573B1Multi-chip integrated circuit moduleTEXAS INSTRUMENTS INC·Filed 1997·Granted Jun 4, 2002·127 cites·20 claims
- 0593US6274391B1HDI land grid array packaged device having electrical and optical interconnectsTEXAS INSTRUMENTS INC·Filed 1992·Granted Aug 14, 2001·143 cites·34 claims
- 0693US5306670AMulti-chip integrated circuit module and method for fabrication thereofTEXAS INSTRUMENTS INC·Filed 1993·Granted Apr 26, 1994·207 cites·3 claims
- 0784US8574967B2Method for fabricating array-molded package-on-packageTEXAS INSTRUMENTS INC·Filed 2013·Granted Nov 5, 2013·4 cites·9 claims
- 0884US8304285B2Array-molded package-on-package having redistribution linesGERBER MARK A·Filed 2011·Granted Nov 6, 2012·7 cites·21 claims
- 0982US8800650B2Expandable tubulars for use in geologic structuresSPRAY JEFFERY A·Filed 2007·Granted Aug 12, 2014·36 cites·31 claims
- 1071US7573137B2Controlling flip-chip techniques for concurrent ball bonds in semiconductor devicesTEXAS INSTRUMENTS INC·Filed 2006·Granted Aug 11, 2009·4 cites·9 claims
- 1168US7776653B2Controlling flip-chip techniques for concurrent ball bonds in semiconductor devicesTEXAS INSTRUMENTS INC·Filed 2009·Granted Aug 17, 2010·3 cites·9 claims
- 1264US6717276B2Two-metal layer ball grid array and chip scale package having local interconnects used in wire-bonded and flip-chip semiconductor assemblyTEXAS INSTRUMENTS INC·Filed 2002·Granted Apr 6, 2004·10 cites·20 claims
- 1356US2014030851A1Method for Fabricating Array-Molded Package-on-PackageTEXAS INSTRUMENTS INC·Filed 2013·Application pending·0 cites
- 1455US2008284045A1Method for Fabricating Array-Molded Package-On-PackageTEXAS INSTRUMENTS INC·Filed 2007·Application pending·0 cites
- 1551US2011165731A1Method for Fabricating Array-Molded Package-on-PackageTEXAS INSTRUMENTS INC·Filed 2011·Application pending·0 cites
- 1644US2008011391A1Method for Producing Wear-Resistant and Fatigue-Resistant Edge Layers in Titanium Alloys, and Components Produced TherewithSIEMENS AG·Filed 2005·Application pending·0 cites
- 1740US2004217486A1Two-metal layer ball grid array and chip scale package having local interconnects used in wire-bonded and flip-chip semiconductor assemblyFiled 2004·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →