Inventor
OWADA TOMOKO
JP14 patents
Patents
14 patentsUSD839224SJan 29, 2019
Elastic membrane for semiconductor wafer polishing
EBARA CORP28 citations93
USD859332SSep 10, 2019
Elastic membrane for semiconductor wafer polishing
EBARA CORP10 citations84
USD913977SMar 23, 2021
Elastic membrane for semiconductor wafer polishing
EBARA CORP5 citations83
USD989012SJun 13, 2023
Elastic membrane
EBARA CORP4 citations74
US11088011B2Aug 10, 2021
Elastic membrane, substrate holding device, and polishing apparatus
EBARA CORP2 citations73
US11179823B2Nov 23, 2021
Substrate holding apparatus, elastic membrane, polishing apparatus, and method for replacing elastic membrane
EBARA CORP3 citations72
US12068189B2Aug 20, 2024
Elastic membrane, substrate holding device, and polishing apparatus
EBARA CORP0 citations62
US11958163B2Apr 16, 2024
Substrate holding apparatus, elastic membrane, polishing apparatus, and method for replacing elastic membrane
EBARA CORP1 citations62
USD1021832SApr 9, 2024
Elastic membrane
EBARA CORP0 citations62
USD981969SMar 28, 2023
Elastic membrane for semiconductor wafer polishing apparatus
EBARA CORP0 citations62
USD918161SMay 4, 2021
Elastic membrane
EBARA CORP1 citations62
US11745306B2Sep 5, 2023
Polishing apparatus and method of controlling inclination of stationary ring
EBARA CORP0 citations52
US11731235B2Aug 22, 2023
Polishing apparatus and polishing method
EBARA CORP0 citations52
US11654524B2May 23, 2023
Method of detecting abnormality of a roller which transmits a local load to a retainer ring, and polishing apparatus
EBARA CORP0 citations52