Inventor · disambiguated record
Hee-Bum Shin
Also filed as: SHIN HEE-BUM
3 granted patents·5 pending applications·1 citations·filing 2006–2022
51Inventor score
Top patents by PatentIndex Score
8 records- 0153US7973248B2Printed circuit board using paste bump and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2008·Granted Jul 5, 2011·0 cites·7 claims
- 0253US2009064497A1Printed circuit board using paste bump and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 0352US8549744B2Printed circuit board using bump and method for manufacturing thereofSHIN HEE-BUM·Filed 2007·Granted Oct 8, 2013·1 cites·9 claims
- 0450US2007107934A1Printed circuit board using paste bump and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 0550US2024183052A1A process for electrochemical deposition of copper with different current densitiesATOTECH DEUTSCHLAND GMBH & CO KG·Filed 2022·Application pending·0 cites
- 0645US2011089138A1Method of manufacturing printed circuit boardKO YOUNG GWAN·Filed 2009·Application pending·0 cites
- 0743US8220149B2Method of manufacturing a printed circuit boardSHIN HEE-BUM·Filed 2008·Granted Jul 17, 2012·0 cites·6 claims
- 0842US2012255769A1Printed circuit boardSHIN HEE-BUM·Filed 2012·Application pending·0 cites
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