Inventor · disambiguated record
David S. Becker
Also filed as: BECKER DAVID · BECKER DAVID S · BECKER DAVID SCOTT
52 granted patents·4 pending applications·1,573 citations·filing 1990–2024
99Inventor score
Files withMICRON TECHNOLOGY INC39TEL FSI INC4FSI INT INC2TEL MFG AND ENGINEERING OF AMERICA INC2DONOHOE KEVIN G1
Top patents by PatentIndex Score
56 records- 0199US6784108B1Gas pulsing for etch profile controlMICRON TECHNOLOGY INC·Filed 2000·Granted Aug 31, 2004·567 cites·40 claims
- 0295US5286344AProcess for selectively etching a layer of silicon dioxide on an underlying stop layer of silicon nitrideMICRON TECHNOLOGY INC·Filed 1992·Granted Feb 15, 1994·207 cites·31 claims
- 0393US7049244B2Method for enhancing silicon dioxide to silicon nitride selectivityMICRON TECHNOLOGY INC·Filed 2001·Granted May 23, 2006·63 cites·114 claims
- 0490US10062596B2Systems and methods for treating substrates with cryogenic fluid mixturesTEL FSI INC·Filed 2015·Granted Aug 28, 2018·5 cites·18 claims
- 0590US10020217B2Systems and methods for treating substrates with cryogenic fluid mixturesTEL FSI INC·Filed 2015·Granted Jul 10, 2018·5 cites·20 claims
- 0690US10014191B2Systems and methods for treating substrates with cryogenic fluid mixturesTEL FSI INC·Filed 2016·Granted Jul 3, 2018·5 cites·15 claims
- 0785US6890863B1Etchant and method of useMICRON TECHNOLOGY INC·Filed 2000·Granted May 10, 2005·26 cites·35 claims
- 0884US5094712AOne chamber in-situ etch process for oxide and conductive materialMICRON TECHNOLOGY INC·Filed 1990·Granted Mar 10, 1992·107 cites·10 claims
- 0982US5252517AMethod of conductor isolation from a conductive contact plugMICRON SEMICONDUCTOR INC·Filed 1992·Granted Oct 12, 1993·53 cites·21 claims
- 1081US7163641B2Method of forming high aspect ratio aperturesMICRON TECHNOLOGY INC·Filed 2003·Granted Jan 16, 2007·16 cites·30 claims
- 1177US6681781B2Methods for cleaning microelectronic substrates using ultradilute cleaning liquidsFSI INT INC·Filed 1999·Granted Jan 27, 2004·51 cites·12 claims
- 1277US6342165B1Method of forming high aspect ratio aperturesMICRON TECHNOLOGY INC·Filed 2000·Granted Jan 29, 2002·13 cites·13 claims
- 1374US10748789B2Systems and methods for treating substrates with cryogenic fluid mixturesTEL FSI INC·Filed 2018·Granted Aug 18, 2020·1 cites·8 claims
- 1473US6123862AMethod of forming high aspect ratio aperturesMICRON TECHNOLOGY INC·Filed 1998·Granted Sep 26, 2000·28 cites·19 claims
- 1572US6610212B2Method of forming high aspect ratio aperturesMICRON TECHNOLOGY INC·Filed 2002·Granted Aug 26, 2003·9 cites·12 claims
- 1671US6018184ASemiconductor structure useful in a self-aligned contact having multiple insulation layers of non-uniform thicknessMICRON TECHNOLOGY INC·Filed 1998·Granted Jan 25, 2000·30 cites·46 claims
- 1769US6207571B1Self-aligned contact formation for semiconductor devicesMICRON TECHNOLOGY INC·Filed 2000·Granted Mar 27, 2001·13 cites·22 claims
- 1868US7074724B2Etchant and method of useMICRON TECHNOLOGY INC·Filed 2004·Granted Jul 11, 2006·8 cites·19 claims
- 1968US5770498AProcess for forming a diffusion barrier using an insulating spacer layerMICRON TECHNOLOGY INC·Filed 1996·Granted Jun 23, 1998·24 cites·11 claims
- 2064US8726848B2Poultry cart handler and methodMELHORN J MICHAEL·Filed 2011·Granted May 20, 2014·4 cites·16 claims
- 2164US6492279B1Plasma etching methodsMICRON TECHNOLOGY INC·Filed 2000·Granted Dec 10, 2002·7 cites·38 claims
- 2264US6287978B1Method of etching a substrateMICRON TECHNOLOGY INC·Filed 1999·Granted Sep 11, 2001·20 cites·38 claims
- 2363US6015760AMethod for enhancing oxide to nitride selectivity through the use of independent heat controlMICRON TECHNOLOGY INC·Filed 1997·Granted Jan 18, 2000·20 cites·24 claims
- 2463US5899749AIn situ etch process for insulating and conductive materialsMICRON TECHNOLOGY INC·Filed 1997·Granted May 4, 1999·23 cites·44 claims
- 2563US5498570AMethod of reducing overetch during the formation of a semiconductor deviceMICRON TECHNOLOGY INC·Filed 1994·Granted Mar 12, 1996·19 cites·20 claims
- 2663US2021050233A1Systems and methods for treating substrates with cryogenic fluid mixturesTEL MFG AND ENGINEERING OF AMERICA INC·Filed 2020·Application pending·0 cites
- 2762US9059104B2Process for selectively removing nitride from substratesRATKOVICH ANTHONY S·Filed 2011·Granted Jun 16, 2015·2 cites·26 claims
- 2862US5869403ASemiconductor processing methods of forming a contact opening to a semiconductor substrateMICRON TECHNOLOGY INC·Filed 1997·Granted Feb 9, 1999·22 cites·39 claims
- 2961US6036786AEliminating stiction with the use of cryogenic aerosolFSI INT INC·Filed 1997·Granted Mar 14, 2000·24 cites·27 claims
- 3060US5691246AIn situ etch process for insulating and conductive materialsMICRON TECHNOLOGY INC·Filed 1993·Granted Nov 25, 1997·26 cites·7 claims
- 3159US5880036AMethod for enhancing oxide to nitride selectivity through the use of independent heat controlMICRON TECHNOLOGY INC·Filed 1993·Granted Mar 9, 1999·19 cites·32 claims
- 3258US6080672ASelf-aligned contact formation for semiconductor devicesMICRON TECHNOLOGY INC·Filed 1997·Granted Jun 27, 2000·19 cites·16 claims
- 3357US6331495B1Semiconductor structure useful in a self-aligned contact etch and method for making sameMICRON TECHNOLOGY INC·Filed 1999·Granted Dec 18, 2001·16 cites·35 claims
- 3456US7608196B2Method of forming high aspect ratio aperturesMICRON TECHNOLOGY INC·Filed 2006·Granted Oct 27, 2009·0 cites·14 claims
- 3555US11355376B2Systems and methods for treating substrates with cryogenic fluid mixturesTEL MFG AND ENGINEERING OF AMERICA INC·Filed 2015·Granted Jun 7, 2022·0 cites·19 claims
- 3655US6277759B1Plasma etching methodsMICRON TECHNOLOGY INC·Filed 1998·Granted Aug 21, 2001·16 cites·8 claims
- 3753US7183220B1Plasma etching methodsMICRON TECHNOLOGY INC·Filed 2000·Granted Feb 27, 2007·3 cites·78 claims
- 3853US5756216AHighly selective nitride spacer etchMICRON TECHNOLOGY INC·Filed 1997·Granted May 26, 1998·15 cites·9 claims
- 3953US5753565AMethod of reducing overetch during the formation of a semiconductor deviceMICRON TECHNOLOGY INC·Filed 1996·Granted May 19, 1998·15 cites·10 claims
- 4052US2006186087A1Etchant and method of useDONOHOE KEVIN G·Filed 2006·Application pending·0 cites
- 4151US8028384B2Multi piece burial vault base and method of making the sameWILBERT FUNERAL SERVICES INC·Filed 2009·Granted Oct 4, 2011·2 cites·7 claims
- 4251US6051501AMethod of reducing overetch during the formation of a semiconductor deviceMICRON TECHNOLOGY INC·Filed 1996·Granted Apr 18, 2000·13 cites·24 claims
- 4351US5994237ASemiconductor processing methods of forming a contact opening to a semiconductor substrateMICRON TECHNOLOGY INC·Filed 1999·Granted Nov 30, 1999·13 cites·12 claims
- 4451US5895262AMethods for etching fuse openings in a semiconductor deviceMICRON TECHNOLOGY INC·Filed 1996·Granted Apr 20, 1999·12 cites·48 claims
- 4549US6436844B2Semiconductor structure useful in a self-aligned contact etch and method for making sameMICRON TECHNOLOGY INC·Filed 2001·Granted Aug 20, 2002·2 cites·8 claims
- 4648US12412220B2Digital platform for connecting insurance related transactionsEIG SERVICES INC·Filed 2024·Granted Sep 9, 2025·0 cites·22 claims
- 4746US6759320B2Method of reducing overetch during the formation of a semiconductor deviceMICRON TECHNOLOGY INC·Filed 2002·Granted Jul 6, 2004·1 cites·8 claims
- 4845US6239455B1Fuse structuresMICRON TECHNOLOGY INC·Filed 1998·Granted May 29, 2001·8 cites·52 claims
- 4944US6958297B2Plasma etching methodsMICRON TECHNOLOGY INC·Filed 2003·Granted Oct 25, 2005·0 cites·35 claims
- 5043US6812154B2Plasma etching methodsMICRON TECHNOLOGY INC·Filed 2002·Granted Nov 2, 2004·0 cites·53 claims
Showing the top 50 of 56 patent records by PatentIndex Score.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →