Inventor · disambiguated record
Geraldine Tsui Yee Lin
Also filed as: LIN GERALDINE TSUI YEE
6 granted patents·274 citations·filing 2003–2012
85Inventor score
Top patents by PatentIndex Score
6 records- 0194US7091581B1Integrated circuit package and process for fabricating the sameASAT LTD·Filed 2004·Granted Aug 15, 2006·122 cites·9 claims
- 0293US7411289B1Integrated circuit package with partially exposed contact pads and process for fabricating the sameASAT LTD·Filed 2004·Granted Aug 12, 2008·101 cites·14 claims
- 0374US8330270B1Integrated circuit package having a plurality of spaced apart pad portionsLIN GERALDINE TSUI YEE·Filed 2004·Granted Dec 11, 2012·22 cites·15 claims
- 0470US6903304B1Process for dressing molded array package saw bladeASAT LTD·Filed 2003·Granted Jun 7, 2005·15 cites·7 claims
- 0565US7732914B1Cavity-type integrated circuit packageMCLELLAN NEIL·Filed 2004·Granted Jun 8, 2010·14 cites·4 claims
- 0647US9520306B2Method of fabricating an integrated circuit (IC) package having a plurality of spaced apart pad portionLIN GERALDINE TSUI YEE·Filed 2012·Granted Dec 13, 2016·0 cites·12 claims
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