Inventor

PARK JUNGRAE

US28 patents

⚠️ This page may combine multiple inventors who share the name “PARK JUNGRAE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

PARK JUNGRAE

APPLIED MATERIALS INC

Wafer coating

Hybrid wafer dicing approach using a bessel beam shaper laser scribing process and plasma etch process

Hybrid wafer dicing approach using a uniform rotating beam laser scribing process and plasma etch process

Mitigation of particle contamination for wafer dicing processes

Hybrid wafer dicing approach using a split beam laser scribing process and plasma etch process

Hybrid wafer dicing approach using a rotating beam laser scribing process and plasma etch process

Baking tool for improved wafer coating process

Hybrid wafer dicing approach using a split beam laser scribing process and plasma etch process

Wafer dicing method for improving die packaging quality

Laser scribing trench opening control in wafer dicing using hybrid laser scribing and plasma etch approach

Methods and apparatus for mask patterning debris removal

Methods and apparatus for mask patterning debris removal

Hybrid wafer dicing approach using a spatially multi-focused laser beam laser scribing process and plasma etch process

Automatic kerf offset mapping and correction system for laser dicing

Mitigation of particle contamination for wafer dicing processes

Wafer coating

Hybrid wafer dicing approach using an actively-focused laser beam laser scribing process and plasma etch process

Hybrid wafer dicing approach using a multiple pass laser scribing process and plasma etch process

LEI WEI-SHENG

UV-cure pre-treatment of carrier film for wafer dicing using hybrid laser scribing and plasma etch approach

Hybrid wafer dicing approach using a line shaped laser beam profile laser scribing process and plasma etch process

Hybrid wafer dicing approach using a rectangular shaped two-dimensional top hat laser beam profile or a linear shaped one-dimensional top hat laser beam profile laser scribing process and plasma etch process

Wafer dicing using hybrid laser scribing and plasma etch approach with intermediate non-reactive post mask-opening clean

Method of wafer dicing using hybrid laser scribing and plasma etch approach with mask plasma treatment for improved mask etch resistance

PARK JUNGRAE

Hybrid wafer dicing approach using a phase modulated laser beam profile laser scribing process and plasma etch process

Hybrid wafer dicing approach using laser scribing process based on an elliptical laser beam profile or a spatio-temporal controlled laser beam profile

Hybrid wafer dicing approach using an adaptive optics-controlled laser scribing process and plasma etch process

PAPANU JAMES S

Method of die singulation using laser ablation and induction of internal defects with a laser

NAGARAJAN RAMASWAMY

Wireless passive radio-frequency strain and displacement sensors