Inventor · disambiguated record
Addi B. Mistry
Also filed as: MISTRY ADDI B · MISTRY ADDI BURJORJI
7 granted patents·2 pending applications·777 citations·filing 1998–2009
90Inventor score
Top patents by PatentIndex Score
9 records- 0194US6077726AMethod and apparatus for stress relief in solder bump formation on a semiconductor deviceMOTOROLA INC·Filed 1998·Granted Jun 20, 2000·225 cites·13 claims
- 0294US5943597ABumped semiconductor device having a trench for stress reliefMOTOROLA INC·Filed 1998·Granted Aug 24, 1999·261 cites·13 claims
- 0392US6815254B2Semiconductor package with multiple sides having package contactsFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Nov 9, 2004·164 cites·28 claims
- 0489US8044494B2Stackable molded packages and methods of making the sameFREESCALE SEMICONDUCTOR INC·Filed 2009·Granted Oct 25, 2011·19 cites·17 claims
- 0589US7262615B2Method and apparatus for testing a semiconductor structure having top-side and bottom-side connectionsFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Aug 28, 2007·30 cites·20 claims
- 0685US6429531B1Method and apparatus for manufacturing an interconnect structureMOTOROLA INC·Filed 2000·Granted Aug 6, 2002·52 cites·11 claims
- 0774US7479407B2Digital and RF system and method thereforFREESCALE SEMICONDUCTOR INC·Filed 2002·Granted Jan 20, 2009·26 cites·5 claims
- 0848US2008108179A1Stackable molded packages and methods of making the sameFREESCALE SEMICONDUCTOR INC·Filed 2008·Application pending·0 cites
- 0943US2007141751A1Stackable molded packages and methods of making the sameMISTRY ADDI B·Filed 2005·Application pending·0 cites
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