Inventor · disambiguated record
Makoto Tsutsue
Also filed as: TSUTSUE MAKOTO
19 granted patents·8 pending applications·192 citations·filing 1999–2023
94Inventor score
Files withPANASONIC CORP12MATSUSHITA ELECTRIC INDUSTRIAL CO LTD4SANDISK TECHNOLOGIES LLC3TSUTSUE MAKOTO3MATSUSHITA ELECTRIC CO LTD1
Top patents by PatentIndex Score
27 records- 0194US9673154B2Semiconductor devicePANASONIC CORP·Filed 2016·Granted Jun 6, 2017·7 cites·20 claims
- 0294US7989334B2Method of manufacturing semiconductor devicePANASONIC CORP·Filed 2009·Granted Aug 2, 2011·31 cites·8 claims
- 0394US7524752B2Method of manufacturing semiconductor devicePANASONIC CORP·Filed 2008·Granted Apr 28, 2009·33 cites·14 claims
- 0493US8618618B2Semiconductor deviceTSUTSUE MAKOTO·Filed 2012·Granted Dec 31, 2013·12 cites·22 claims
- 0593US7453128B2Semiconductor device and method for fabricating the samePANASONIC CORP·Filed 2004·Granted Nov 18, 2008·54 cites·6 claims
- 0693US7417304B2Electronic device and method for fabricating the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Aug 26, 2008·19 cites·11 claims
- 0789US8247876B2Semiconductor deviceTSUTSUE MAKOTO·Filed 2011·Granted Aug 21, 2012·7 cites·12 claims
- 0885US8710595B2Semiconductor devicePANASONIC CORP·Filed 2013·Granted Apr 29, 2014·4 cites·20 claims
- 0980US7948039B2Semiconductor device and method for fabricating the samePANASONIC CORP·Filed 2008·Granted May 24, 2011·5 cites·24 claims
- 1078US9082779B2Semiconductor devicePANASONIC CORP·Filed 2014·Granted Jul 14, 2015·2 cites·16 claims
- 1178US7795705B2Semiconductor device and manufacturing method thereofPANASONIC CORP·Filed 2008·Granted Sep 14, 2010·6 cites·25 claims
- 1268US8564136B2Semiconductor device and method for fabricating the sameTSUTSUE MAKOTO·Filed 2011·Granted Oct 22, 2013·2 cites·7 claims
- 1366US8035197B2Electronic device and method for fabricating the samePANASONIC CORP·Filed 2010·Granted Oct 11, 2011·1 cites·9 claims
- 1459US2025087525A1Semiconductor device fabrication method using a deposition apparatus with a contoured wafer carrier ringWESTERN DIGITAL TECH INC·Filed 2023·Application pending·0 cites
- 1555US11749554B2Multi-wafer deposition tool for reducing residual deposition on transfer blades and methods of operating the sameSANDISK TECHNOLOGIES LLC·Filed 2020·Granted Sep 5, 2023·0 cites·20 claims
- 1655US11702750B2Method and apparatus for depositing a multi-sector film on backside of a semiconductor waferSANDISK TECHNOLOGIES LLC·Filed 2020·Granted Jul 18, 2023·0 cites·4 claims
- 1755US2015194391A1Semiconductor devicePANASONIC CORP·Filed 2015·Application pending·0 cites
- 1855US2008299708A1Electronic device and method for fabricating the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2008·Application pending·0 cites
- 1954US7994589B2Semiconductor device and method for fabricating the samePANASONIC CORP·Filed 2010·Granted Aug 9, 2011·0 cites·9 claims
- 2051US11473199B2Method and apparatus for depositing a multi-sector film on backside of a semiconductor waferSANDISK TECHNOLOGIES LLC·Filed 2020·Granted Oct 18, 2022·0 cites·9 claims
- 2150US2008158775A1Semiconductor device and method for fabricating the sameMATSUSHITA ELECTRIC CO LTD·Filed 2008·Application pending·0 cites
- 2247US7985675B2Method for fabricating a semiconductor device that includes processing an insulating film to have an upper portion with a different composition than an other portionPANASONIC CORP·Filed 2008·Granted Jul 26, 2011·0 cites·20 claims
- 2346US2006054960A1Semiconductor device and method for fabricating the sameSEO SATOSHI·Filed 2005·Application pending·0 cites
- 2441US2006175705A1Semiconductor device and method for fabricating the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2006·Application pending·0 cites
- 2538US2004099897A1Semiconductor device and method for fabricating the sameFiled 2003·Application pending·0 cites
- 2636US6579649B2Polymer electrolyte batteryMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Jun 17, 2003·9 cites·10 claims
- 2735US2011081776A1Method for manufacturing semiconductor deviceNOMURA KOTARO·Filed 2010·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →