Inventor · disambiguated record
John S. Guzek
Also filed as: GUZEK JOHN · GUZEK JOHN S · GUZEK JOHN S JR · GUZEK JOHN STEPHEN
83 granted patents·24 pending applications·924 citations·filing 2001–2025
99Inventor score
Top patents by PatentIndex Score
107 records- 0199US9269701B2Localized high density substrate routingINTEL CORP·Filed 2015·Granted Feb 23, 2016·49 cites·20 claims
- 0297US9679843B2Localized high density substrate routingINTEL CORP·Filed 2016·Granted Jun 13, 2017·17 cites·20 claims
- 0397US9224674B2Packaged semiconductor die with bumpless die-package interface for bumpless build-up layer (BBUL) packagesMALATKAR PRAMOD·Filed 2011·Granted Dec 29, 2015·38 cites·28 claims
- 0497US9153552B2Bumpless build-up layer package including an integrated heat spreaderINTEL CORP·Filed 2014·Granted Oct 6, 2015·43 cites·8 claims
- 0597US8912670B2Bumpless build-up layer package including an integrated heat spreaderINTEL CORP·Filed 2012·Granted Dec 16, 2014·53 cites·10 claims
- 0697US8535989B2Embedded semiconductive chips in reconstituted wafers, and systems containing sameSANKMAN ROBERT L·Filed 2010·Granted Sep 17, 2013·40 cites·24 claims
- 0797US8264849B2Mold compounds in improved embedded-die coreless substrates, and processes of forming sameGUZEK JOHN S·Filed 2010·Granted Sep 11, 2012·49 cites·29 claims
- 0896US9136236B2Localized high density substrate routingSTARKSTON ROBERT·Filed 2012·Granted Sep 15, 2015·69 cites·16 claims
- 0996US8618652B2Forming functionalized carrier structures with coreless packagesNALLA RAVI K·Filed 2010·Granted Dec 31, 2013·30 cites·15 claims
- 1095US10930596B2Embedded die on interposer packagesINTEL CORP·Filed 2016·Granted Feb 23, 2021·9 cites·14 claims
- 1195US9941245B2Integrated circuit packages including high density bump-less build up layers and a lesser density core or coreless substrateSKEETE OSWALD·Filed 2007·Granted Apr 10, 2018·80 cites·10 claims
- 1295US8313958B2Magnetic microelectronic device attachmentSWAMINATHAN RAJASEKARAN·Filed 2010·Granted Nov 20, 2012·28 cites·23 claims
- 1394US10651051B2Embedded semiconductive chips in reconstituted wafers, and systems containing sameINTEL CORP·Filed 2017·Granted May 12, 2020·6 cites·10 claims
- 1494US10366951B2Localized high density substrate routingINTEL CORP·Filed 2017·Granted Jul 30, 2019·7 cites·20 claims
- 1594US10170409B2Package on package architecture and method for makingGANESAN SANKA·Filed 2013·Granted Jan 1, 2019·22 cites·20 claims
- 1694US9520376B2Bumpless build-up layer package including an integrated heat spreaderINTEL CORP·Filed 2015·Granted Dec 13, 2016·11 cites·7 claims
- 1794US8093704B2Package on package using a bump-less build up layer (BBUL) packagePALMER ERIC C·Filed 2008·Granted Jan 10, 2012·69 cites·10 claims
- 1893US11515248B2Localized high density substrate routingINTEL CORP·Filed 2020·Granted Nov 29, 2022·2 cites·22 claims
- 1993US9859253B1Integrated circuit package stackINTEL CORP·Filed 2016·Granted Jan 2, 2018·12 cites·14 claims
- 2093US9691711B2Method of making an electromagnetic interference shield for semiconductor chip packagesINTEL CORP·Filed 2016·Granted Jun 27, 2017·9 cites·18 claims
- 2193US8969140B2Embedded semiconductive chips in reconstituted wafers, and systems containing sameINTEL CORP·Filed 2013·Granted Mar 3, 2015·8 cites·19 claims
- 2291US9646851B2Embedded semiconductive chips in reconstituted wafers, and systems containing sameINTEL CORP·Filed 2016·Granted May 9, 2017·4 cites·14 claims
- 2391US8901724B2Semiconductor package with embedded die and its methods of fabricationGUZEK JOHN STEPHEN·Filed 2009·Granted Dec 2, 2014·28 cites·7 claims
- 2491US8742561B2Recessed and embedded die coreless packageGUZEK JOHN·Filed 2009·Granted Jun 3, 2014·15 cites·12 claims
- 2591US8513792B2Package-on-package interconnect stiffenerGANESAN SANKA·Filed 2009·Granted Aug 20, 2013·20 cites·18 claims
- 2691US7851269B2Method of stiffening coreless package substrateINTEL CORP·Filed 2009·Granted Dec 14, 2010·16 cites·17 claims
- 2791US2024421073A1Localized high density substrate routingINTEL CORP·Filed 2024·Application pending·0 cites
- 2891US2025323145A1Localized high density substrate routingINTEL CORP·Filed 2025·Application pending·0 cites
- 2990US9847234B2Embedded semiconductive chips in reconstituted wafers, and systems containing sameINTEL CORP·Filed 2015·Granted Dec 19, 2017·4 cites·15 claims
- 3090US8035218B2Microelectronic package and method of manufacturing sameINTEL CORP·Filed 2009·Granted Oct 11, 2011·19 cites·12 claims
- 3189US8786066B2Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming sameGUZEK JOHN S·Filed 2010·Granted Jul 22, 2014·11 cites·36 claims
- 3288US9147669B2Recessed and embedded die coreless packageINTEL CORP·Filed 2014·Granted Sep 29, 2015·5 cites·15 claims
- 3388US8891246B2System-in-package using embedded-die coreless substrates, and processes of forming sameGUZEK JOHN S·Filed 2010·Granted Nov 18, 2014·10 cites·34 claims
- 3487US8937382B2Secondary device integration into coreless microelectronic device packagesTEH WENG HONG·Filed 2011·Granted Jan 20, 2015·8 cites·5 claims
- 3586US7569471B2Method of providing mixed size solder bumps on a substrate using a solder delivery headINTEL CORP·Filed 2006·Granted Aug 4, 2009·16 cites·7 claims
- 3685US7042077B2Integrated circuit package with low modulus layer and capacitor/interposerINTEL CORP·Filed 2004·Granted May 9, 2006·35 cites·19 claims
- 3783US11984396B2Localized high density substrate routingINTEL CORP·Filed 2022·Granted May 14, 2024·0 cites·20 claims
- 3883US9312233B2Method of forming molded panel embedded die structureINTEL CORP·Filed 2013·Granted Apr 12, 2016·5 cites·28 claims
- 3982US12230582B2Embedded die on interposer packagesINTEL CORP·Filed 2023·Granted Feb 18, 2025·0 cites·19 claims
- 4082US12107042B2Localized high density substrate routingINTEL CORP·Filed 2022·Granted Oct 1, 2024·0 cites·20 claims
- 4182US10636769B2Semiconductor package having spacer layerINTEL CORP·Filed 2018·Granted Apr 28, 2020·2 cites·21 claims
- 4282US7485563B2Method of providing solder bumps of mixed sizes on a substrate using a sorting mask and bumped substrate formed according to the methodINTEL CORP·Filed 2006·Granted Feb 3, 2009·10 cites·11 claims
- 4381US9490196B2Multi die package having a die and a spacer layer in a recessTEH WENG HONG·Filed 2011·Granted Nov 8, 2016·4 cites·9 claims
- 4481US7288459B2Organic substrates with integral thin-film capacitors, methods of making same, and systems containing sameINTEL CORP·Filed 2005·Granted Oct 30, 2007·10 cites·26 claims
- 4580US9496211B2Logic die and other components embedded in build-up layersINTEL CORP·Filed 2012·Granted Nov 15, 2016·5 cites·17 claims
- 4680US2022172962A1Embedded semiconductive chips in reconstituted wafers, and systems containing sameINTEL CORP·Filed 2022·Application pending·0 cites
- 4779US9691728B2BBUL top side substrate layer enabling dual sided silicon interconnect and stacking flexibilityINTEL CORP·Filed 2015·Granted Jun 27, 2017·3 cites·5 claims
- 4879US2023420400A1Packaged semiconductor die with bumpless die-package interface for bumpless build-up layer (bbul) packagesINTEL CORP·Filed 2023·Application pending·0 cites
- 4977US9832860B2Panel level fabrication of package substrates with integrated stiffenersINTEL CORP·Filed 2014·Granted Nov 28, 2017·4 cites·15 claims
- 5077US9001520B2Microelectronic structures having laminated or embedded glass routing structures for high density packagingINTEL CORP·Filed 2012·Granted Apr 7, 2015·3 cites·7 claims
Showing the top 50 of 107 patent records by PatentIndex Score.
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