Inventor · disambiguated record
Wing Keung Lam
Also filed as: LAM WING KEUNG
8 granted patents·1 pending application·402 citations·filing 2002–2023
89Inventor score
Top patents by PatentIndex Score
9 records- 0196US6987032B1Ball grid array package and process for manufacturing sameASAT LTD·Filed 2003·Granted Jan 17, 2006·126 cites·29 claims
- 0294US7315080B1Ball grid array package that includes a collapsible spacer for separating die adapter from a heat spreaderASAT LTD·Filed 2004·Granted Jan 1, 2008·76 cites·5 claims
- 0394US6737755B1Ball grid array package with improved thermal characteristicsASAT LTD·Filed 2002·Granted May 18, 2004·109 cites·14 claims
- 0490US6586834B1Die-up tape ball grid array packageASAT LTD·Filed 2002·Granted Jul 1, 2003·78 cites·8 claims
- 0578US8610262B1Ball grid array package with improved thermal characteristicsMCLELLAN NEIL·Filed 2005·Granted Dec 17, 2013·9 cites·11 claims
- 0676US11227818B2Stacked dies electrically connected to a package substrate by lead terminalsUTAC HEADQUARTERS PTE LTD·Filed 2020·Granted Jan 18, 2022·1 cites·19 claims
- 0772US9449903B2Ball grid array package with improved thermal characteristicsUTAC HONG KONG LTD·Filed 2013·Granted Sep 20, 2016·3 cites·7 claims
- 0851US11945004B2System and method of cleaning and inspecting semiconductor die carrierUTAC HEADQUARTERS PTE LTD·Filed 2021·Granted Apr 2, 2024·0 cites·20 claims
- 0948US2024234195A9Semiconductor Device and Method of Making a Substrate with Improved Substrate Mounting ApparatusUTAC HEADQUARTERS PTE LTD·Filed 2023·Application pending·0 cites
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