Inventor

TENG YI-CHUAN

TW49 patents

⚠️ This page may combine multiple inventors who share the name “TENG YI-CHUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TENG YI-CHUAN

TAIWAN SEMICONDUCTOR MFG CO LTD

CMOS-MEMS device structure, bonding mesa structure and associated method

Semiconductor device and method for fabricating the same

MEMS devices including MEMS dies and connectors thereto

MEMS devices including MEMS dies and connectors thereto

Structure and formation method of semiconductor device structure

MEMS devices including MEMS dies and connectors thereto

Vacuum sealed MEMS and CMOS package

Vacuum sealed MEMS and CMOS package

MEMS device and manufacturing method thereof

Method of forming dielectric and metal sealing layers on capping structure of a MEMs device

Semiconductor structure and manufacturing method for the same

Method for manufacturing semiconductor structure

Semiconductor device structure with movable membrane

Semiconductor device and method for fabricating the same

Integrated heater (and related method) to recover degraded piezoelectric device performance

Semiconductor device structure with movable membrane

Semiconductor structure and method for forming the same

Dual micro-electro mechanical system and manufacturing method thereof

Integration scheme for breakdown voltage enhancement of a piezoelectric metal-insulator-metal device

Semiconductor structure and method for manufacturing thereof

Integrated heater (and related method) to recover degraded piezoelectric device performance

Semiconductor structure and method for fabricating the same

Method of forming semiconductor device structure

Semiconductor device and manufacturing method of semiconductor device

Dual micro-electro mechanical system and manufacturing method thereof

MEMS devices including MEMS dies and connectors thereto

Integration scheme for breakdown voltage enhancement of a piezoelectric metal-insulator-metal device

Wafer level packaging techniques

MEMS device and method for making the same

Reduction of electric field enhanced moisture penetration by metal shielding

Micro electro mechanical system (MEMs) device having metal sealing on necking portion of vent hole

Method for manufacturing semiconductor device

Layer for buffer semiconductor device including microelectromechnical system (MEMS) device

Semiconductor device

Semiconductor device with through molding vias and method of making the same

Method and apparatus for a wafer seal ring

Method of removing waste of substrate and waste removing device thereof

Electronic device including a capacitor

TAIWAN SEMICONDUCTOR MFG

MEMS devices and methods for forming same

Semiconductor arrangement with stress release configuration

Semiconductor device

Systems and methods for post-bonding wafer edge seal

Semiconductor arrangement with thermal insulation configuration

Semiconductor device with through molding vias

Semiconductor arrangement with stress release and thermal insulation

(unassigned)

Structure of speaker use on ship

TAIWAN SEMICONDUCTOR MFG COMPANY LTD

Dual micro-electro mechanical system and manufacturing method thereof

ARTILUX INC

Wafer-level device measurement for optical sensors

HUANG HSIN-TING

Bonding layer structure and method for wafer to wafer bonding