Inventor
PAEK JONG SIK
KR81 patents
⚠️ This page may combine multiple inventors who share the name “PAEK JONG SIK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
AMKOR TECHNOLOGY INC
33 patentsUS6927478B2Aug 9, 2005
Reduced size semiconductor package with stacked dies
AMKOR TECHNOLOGY INC193 citations99
US6858919B2Feb 22, 2005
Semiconductor package
AMKOR TECHNOLOGY INC130 citations99
US6759737B2Jul 6, 2004
Semiconductor package including stacked chips with aligned input/output pads
AMKOR TECHNOLOGY INC105 citations98
US8362612B1Jan 29, 2013
Semiconductor device and manufacturing method thereof
AMKOR TECHNOLOGY INC53 citations97
US7335986B1Feb 26, 2008
Wafer level chip scale package
AMKOR TECHNOLOGY INC57 citations96
US6953988B2Oct 11, 2005
Semiconductor package
AMKOR TECHNOLOGY INC60 citations96
US9484331B2Nov 1, 2016
Semiconductor device and manufacturing method thereof
AMKOR TECHNOLOGY INC18 citations93
US7045882B2May 16, 2006
Semiconductor package including flip chip
AMKOR TECHNOLOGY INC16 citations93
US6846704B2Jan 25, 2005
Semiconductor package and method for manufacturing the same
AMKOR TECHNOLOGY INC37 citations93
US6740950B2May 25, 2004
Optical device packages having improved conductor efficiency, optical coupling and thermal transfer
AMKOR TECHNOLOGY INC40 citations93
US6700187B2Mar 2, 2004
Semiconductor package and method for manufacturing the same
AMKOR TECHNOLOGY INC37 citations93
US9391043B2Jul 12, 2016
Semiconductor device and manufacturing method thereof
AMKOR TECHNOLOGY INC12 citations92
US9048125B2Jun 2, 2015
Semiconductor device and manufacturing method thereof
AMKOR TECHNOLOGY INC20 citations92
US7446422B1Nov 4, 2008
Wafer level chip scale package and manufacturing method for the same
AMKOR TECHNOLOGY INC26 citations92
US6841874B1Jan 11, 2005
Wafer-level chip-scale package
AMKOR TECHNOLOGY INC19 citations92
US7045893B1May 16, 2006
Semiconductor package and method for manufacturing the same
AMKOR TECHNOLOGY INC32 citations90
US10297466B2May 21, 2019
Semiconductor device and manufacturing method thereof
AMKOR TECHNOLOGY INC4 citations84
US10032740B2Jul 24, 2018
Semiconductor device and manufacturing method thereof
AMKOR TECHNOLOGY INC5 citations84
US9966276B2May 8, 2018
Semiconductor device and manufacturing method thereof
AMKOR TECHNOLOGY INC5 citations84
US9536858B2Jan 3, 2017
Semiconductor device and manufacturing method thereof
AMKOR TECHNOLOGY INC3 citations84
US9466580B2Oct 11, 2016
Semiconductor package and manufacturing method thereof
AMKOR TECHNOLOGY INC9 citations84
US9418922B2Aug 16, 2016
Semiconductor device with reduced thickness
AMKOR TECHNOLOGY INC12 citations84
US7808105B1Oct 5, 2010
Semiconductor package and fabricating method thereof
AMKOR TECHNOLOGY INC14 citations84
US7359579B1Apr 15, 2008
Image sensor package and its manufacturing method
AMKOR TECHNOLOGY INC19 citations84
US6987319B1Jan 17, 2006
Wafer-level chip-scale package
AMKOR TECHNOLOGY INC15 citations84
US9818685B2Nov 14, 2017
Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers
AMKOR TECHNOLOGY INC4 citations83
US10079157B2Sep 18, 2018
Semiconductor device and manufacturing method thereof
AMKOR TECHNOLOGY INC9 citations82
US9929113B2Mar 27, 2018
Semiconductor package and manufacturing method thereof
AMKOR TECHNOLOGY INC3 citations73
US9478517B2Oct 25, 2016
Electronic device package structure and method of fabricating the same
AMKOR TECHNOLOGY INC6 citations73
US10679952B2Jun 9, 2020
Semiconductor device having an encapsulated front side and interposer and manufacturing method thereof
AMKOR TECHNOLOGY INC2 citations72
US10199322B2Feb 5, 2019
Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers
AMKOR TECHNOLOGY INC1 citations72
US10090185B2Oct 2, 2018
Semiconductor device and manufacturing method thereof
AMKOR TECHNOLOGY INC1 citations63
US9502375B2Nov 22, 2016
Semiconductor device with plated pillars and leads
AMKOR TECHNOLOGY INC2 citations63
MICRON TECHNOLOGY INC
6 patentsUS11942430B2Mar 26, 2024
Stacked die modules for semiconductor device assemblies and methods of manufacturing stacked die modules
MICRON TECHNOLOGY INC4 citations75
US11456289B2Sep 27, 2022
Face-to-face semiconductor device with fan-out porch
MICRON TECHNOLOGY INC1 citations72
US11764161B2Sep 19, 2023
Ground connection for semiconductor device assembly
MICRON TECHNOLOGY INC2 citations70
US11515174B2Nov 29, 2022
Semiconductor devices with package-level compartmental shielding and associated systems and methods
MICRON TECHNOLOGY INC2 citations70
US12543583B2Feb 3, 2026
Stacked die modules for semiconductor device assemblies and methods of manufacturing stacked die modules
MICRON TECHNOLOGY INC0 citations63
US12347737B2Jul 1, 2025
Semiconductor device with a porous air vent
MICRON TECHNOLOGY INC0 citations63
AMKOR TECH SINGAPORE HOLDING PTE LTD
5 patentsUS11043464B2Jun 22, 2021
Semiconductor device having upper and lower redistribution layers
AMKOR TECH SINGAPORE HOLDING PTE LTD2 citations73
US11101144B2Aug 24, 2021
Semiconductor device and manufacturing method thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD2 citations71
US11935856B2Mar 19, 2024
Semiconductor device having a redistribution layer
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations63
US11501978B2Nov 15, 2022
Semiconductor device and manufacturing method thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations63
US10985031B2Apr 20, 2021
Semiconductor device and manufacturing method thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations63
PAEK JONG SIK
3 patentsUS8446017B2May 21, 2013
Stackable wafer level package and fabricating method thereof
PAEK JONG SIK22 citations91
US9219042B2Dec 22, 2015
Semiconductor device and manufacturing method thereof
PAEK JONG SIK10 citations83
US8618658B1Dec 31, 2013
Semiconductor device and fabricating method thereof
PAEK JONG SIK7 citations83
JIN JUNG GI
2 patentsDO WON CHUL
1 patentShowing the top 50 of 81 patents by PatentIndex Score.