Wafer-level chip-scale package

Abstract

A wafer-level chip-scale package includes a semiconductor die having planar top and bottom surfaces and a plurality of metal pads formed at the top surface in an area array. A first protective layer is formed on the top surface of the semiconductor die, the first protective layer having a plurality of first apertures for allowing the metal pads to be opened upward. A second protective layer is formed on a surface of the first protective layer, the second protective layer having a plurality of second apertures which are larger than and overly corresponding first apertures of the first protective layer so that regions of the metal pads and the first protective layer are exposed to the outside of the semiconductor die. Solder balls are fused to each metal pad, which are opened to the outside through the first apertures of the first protective layer and the second apertures of the second protective layer.

1. A wafer-level chip-scale package comprising:
 a semiconductor die having top and bottom surfaces of an approximately planar shape and a plurality of metal pads formed at the top surface in an area array through a redistribution process; 
 a first protective layer formed on the top surface of the semiconductor die, the first protective layer having a plurality of first apertures for allowing the metal pads to be opened upward; 
 a second protective layer formed on a surface of the first protective layer, the second protective layer having a plurality of second apertures which are larger than the first apertures of the first protective layer so that regions of the metal pads and the first protective layer are opened to the outside; and 
 a plurality of metal lines for passive elements formed on the surface of the first protective layer, the metal lines being covered with the second protective layer. 
 
     
     
       2. The wafer-level chip-scale package as claimed in  claim 1 , wherein the first protective layer is opened to the outside in an approximately circular ring shape through the second aperture of the second protective layer. 
     
     
       3. The wafer-level chip-scale package as claimed in  claim 1 , wherein the semiconductor die further comprises a side surface perpendicular to the top and bottom surfaces at their ends, the bottom and side surfaces being directly exposed to the outside. 
     
     
       4. The wafer-level chip-scale package as claimed in  claim 1 , wherein the plurality of metal pads comprise wettable surfaces. 
     
     
       5. A wafer-level chip-scale package comprising:
 a semiconductor die having top and bottom surfaces of an approximately planar shape and a plurality of metal pads formed at the top surface in an area array through a redistribution process; 
 a first protective layer formed on the top surface of the semiconductor die, the first protective layer having a plurality of first apertures for allowing the metal pads to be opened upward; 
 a second protective layer formed on a surface of the first protective layer, the second protective layer having a plurality of second apertures for allowing the metal pads to be opened upward; 
 a third protective layer formed on a surface of the second protective layer, the third protective layer having a plurality of third apertures which are larger than the second apertures of the second protective layer so that regions of the metal pads and the second protective layer are opened to the outside; and 
 a plurality of metal lines for passive elements formed on the surface of the second protective layer, the metal lines being covered with the third protective layer. 
 
     
     
       6. The wafer-level chip-scale package as claimed in  claim 5 , wherein the second aperture of the second protective layer is smaller than the first aperture of the first protective layer and the third aperture of the third protective layer is larger than the first and second apertures. 
     
     
       7. The wafer-level chip-scale package as claimed in  claim 5 , wherein the second protective layer is opened to the outside in an approximately circular ring shape through the third aperture of the third protective layer. 
     
     
       8. The wafer-level chip-scale package as claimed in  claim 5 , wherein the semiconductor die further comprises a side surface perpendicular to the top and bottom surfaces at each of their ends, the bottom and side surfaces being directly exposed to the outside. 
     
     
       9. The wafer-level chip-scale package as claimed in  claim 5 , wherein the plurality of metal pads comprise wettable surfaces. 
     
     
       10. A wafer-level chip-scale package comprising:
 a semiconductor die having a top surface and a bottom surface; 
 a plurality of metal pads formed at the top surface of the semiconductor die; 
 a first protective layer formed on the top surface of the semiconductor die, the first protective layer having a plurality of first apertures, wherein one of the plurality of first apertures overlies a corresponding one of the plurality of metal pads; 
 a second protective layer formed on a surface of the first protective layer, the second protective layer having a plurality of second apertures, wherein one of the plurality of second apertures overlies a corresponding one of the plurality of metal pads, and wherein the second apertures of the second protective layer are larger than the first apertures of the first protective layer; and 
 a plurality of metal lines for passive elements formed on the surface of the first protective layer, the metal lines being covered with the second protective layer. 
 
     
     
       11. The wafer-level chip-scale package as claimed in  claim 10 , wherein the plurality of metal pads comprises an area array. 
     
     
       12. The wafer-level chip-scale package as claimed in  claim 10 , wherein the plurality of metal lines for passive elements is connected to the semiconductor die via redistribution lines. 
     
     
       13. The wafer-level chip-scale package as claimed in  claim 10 , wherein the first protective layer and the second protective layer are selected from the group consisting of oxide film, nitride film, Tetra Ethyl Ortho Silicate, Benzo Cyclo Butene, and polyimide. 
     
     
       14. A wafer-level chip-scale package comprising:
 a semiconductor die having a top surface and a bottom surface; 
 a plurality of metal pads formed at the top surface; 
 a first protective layer formed on the top surface of the semiconductor die, the first protective layer having a plurality of first apertures, wherein one of the plurality of first apertures overlies a corresponding one of the plurality of metal pads; 
 a second protective layer formed on a surface of the first protective layer, the second protective layer having a plurality of second apertures, wherein one of the plurality of second apertures overlies a corresponding one of the plurality of metal pads; 
 a third protective layer formed on a surface of the second protective layer, the third protective layer having a plurality of third apertures wherein one of the plurality of third apertures overlies a corresponding one of the plurality of metal pads, and wherein the third apertures of the third protective layer are larger than the second apertures of the second protective layer; and 
 a plurality of metal lines for passive elements formed on the surface of the second protective layer, the metal lines being covered with the third protective layer. 
 
     
     
       15. The wafer-level chip-scale package as claimed in  claim 14 , wherein the plurality of metal lines for passive elements is connected to the semiconductor die via redistribution lines. 
     
     
       16. The wafer-level chip-scale package as claimed in  claim 14 , wherein the first protective layer, the second protective layer, and the third protective layer are selected from the group consisting of oxide film, nitride film, Tetra Ethyl Ortho Silicate, Benzo Cyclo Butene, and polyimide. 
     
     
       17. A wafer-level chip-scale package comprising:
 a semiconductor die having a top surface and a bottom surface; 
 a plurality of metal pads formed at the top surface of the semiconductor die; 
 a first protective layer formed on the top surface of the semiconductor die, the first protective layer having a plurality of first apertures for allowing the metal pads to be opened upward; 
 a second protective layer formed on a surface of the first protective layer, the second protective layer having a plurality of second apertures for allowing the metal pads to be opened upward, the second apertures being smaller than the first apertures; and 
 a third protective layer formed on a surface of the second protective layer, the third protective layer having a plurality of third apertures for allowing the second apertures of the second protective layer and the metal pads to be opened upward, the third apertures being larger than the first and second apertures. 
 
     
     
       18. The wafer-level chip-scale package as claimed in  claim 17  further comprising a plurality of metal lines for passive elements formed on the surface of the second protective layer, the metal lines being covered with the third protective layer. 
     
     
       19. A method comprising:
 providing a semiconductor die having a top surface and a bottom surface; 
 forming a plurality of metal pads at the top surface of the semiconductor die; 
 forming a first protective layer on the top surface of the semiconductor die; 
 etching through the first protective layer a plurality of first apertures, each of the plurality of first apertures overlying a corresponding one of the plurality of metal pads; 
 forming a second protective layer on a surface of the first protective layer and the metal pads; 
 etching through the second protective layer a plurality of second apertures, wherein each of the plurality of second apertures overlies a corresponding one of the plurality of metal pads, and wherein the second apertures of the second protective layer are larger than the first apertures of the first protective layer; and 
 fusing one of a plurality of solder balls to a different one of the plurality of metal pads through a corresponding one of the plurality of first apertures of the first protective layer and a corresponding one of the plurality of second apertures of the second protective layer, wherein the second protective layer and each of the plurality of solder balls are separated. 
 
     
     
       20. The method of  claim 19  wherein the fusing of the plurality of solder balls to the plurality of metal pads comprises:
 temporarily fixing each of the plurality of solder balls to a corresponding one of the plurality of metal pads with flux; 
 introducing the semiconductor die into a furnace; 
 volatilizing the flux in the furnace; and 
 fusing each of the plurality of solder balls to the corresponding one of the plurality of metal pads in the form of an approximately circular ball inside the second aperture.