Inventor · disambiguated record
In Bae Park
Also filed as: PARK IN B · PARK IN BAE
18 granted patents·2 pending applications·178 citations·filing 1999–2023
93Inventor score
Files withAMKOR TECHNOLOGY INC13AMKOR TECH SINGAPORE HOLDING PTE LTD2PAEK JONG SIK2HULASER INC1JUNG BOO YANG1
Top patents by PatentIndex Score
20 records- 0197US8362612B1Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2010·Granted Jan 29, 2013·53 cites·20 claims
- 0289US8446017B2Stackable wafer level package and fabricating method thereofPAEK JONG SIK·Filed 2009·Granted May 21, 2013·22 cites·13 claims
- 0380US9343427B2Manufacturing method of semiconductor device and semiconductor device manufactured therebyAMKOR TECHNOLOGY INC·Filed 2014·Granted May 17, 2016·5 cites·20 claims
- 0480US2024243084A1Wafer level fan out semiconductor device and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Application pending·0 cites
- 0577US9184148B2Semiconductor package and method thereforAMKOR TECHNOLOGY INC·Filed 2014·Granted Nov 10, 2015·3 cites·20 claims
- 0677US6589801B1Wafer-scale production of chip-scale semiconductor packages using wafer mapping techniquesAMKOR TECHNOLOGY INC·Filed 1999·Granted Jul 8, 2003·55 cites·37 claims
- 0775US9653336B2Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted May 16, 2017·2 cites·20 claims
- 0875US6841874B1Wafer-level chip-scale packageAMKOR TECHNOLOGY INC·Filed 2002·Granted Jan 11, 2005·19 cites·17 claims
- 0972US9524906B1Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2013·Granted Dec 20, 2016·2 cites·20 claims
- 1072US6987319B1Wafer-level chip-scale packageAMKOR TECHNOLOGY INC·Filed 2004·Granted Jan 17, 2006·15 cites·20 claims
- 1171US11855023B2Wafer level fan out semiconductor device and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Dec 26, 2023·0 cites·20 claims
- 1259US9748154B1Wafer level fan out semiconductor device and manufacturing method thereofJUNG BOO YANG·Filed 2010·Granted Aug 29, 2017·1 cites·14 claims
- 1357US12506315B2Laser apparatus capable of replacing laserHULASER INC·Filed 2022·Granted Dec 23, 2025·0 cites·8 claims
- 1456US10903181B2Wafer level fan out semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted Jan 26, 2021·0 cites·20 claims
- 1556US9504525B2Handpiece laser treatment apparatus capable of adjusting length of optical fiberPARK IN BAE·Filed 2015·Granted Nov 29, 2016·1 cites·4 claims
- 1654US10483222B1Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted Nov 19, 2019·0 cites·19 claims
- 1751US9543235B2Semiconductor package and method thereforAMKOR TECHNOLOGY INC·Filed 2015·Granted Jan 10, 2017·0 cites·20 claims
- 1850US9048241B2Semiconductor device utilzing redistribution layers to couple stacked diePAEK JONG SIK·Filed 2013·Granted Jun 2, 2015·0 cites·20 claims
- 1947US9190370B2Semiconductor device utilizing redistribution layers to couple stacked dieAMKOR TECHNOLOGY INC·Filed 2015·Granted Nov 17, 2015·0 cites·20 claims
- 2039US2007018322A1Wafer level package and its manufacturing methodAMKOR TECHNOLOGY INC·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →