Inventor · disambiguated record
Seong Min Seo
Also filed as: SEO SEONG M · SEO SEONG MIN
35 granted patents·12 pending applications·613 citations·filing 1995–2025
97Inventor score
Files withAMKOR TECHNOLOGY INC21SAMSUNG ELECTRONICS CO LTD9AMKOR TECH SINGAPORE HOLDING PTE LTD8ANAM IND CO LTD1ANAM SEMICONDUCTOR INC1
Top patents by PatentIndex Score
47 records- 0198US9000586B2Semiconductor device and manufacturing method thereofDO WON CHUL·Filed 2012·Granted Apr 7, 2015·49 cites·20 claims
- 0297US6858919B2Semiconductor packageAMKOR TECHNOLOGY INC·Filed 2001·Granted Feb 22, 2005·130 cites·16 claims
- 0395US9747959B2Stacked memory devices, and memory packages and memory systems having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Aug 29, 2017·18 cites·20 claims
- 0495US6759737B2Semiconductor package including stacked chips with aligned input/output padsAMKOR TECHNOLOGY INC·Filed 2001·Granted Jul 6, 2004·105 cites·24 claims
- 0594US10079157B2Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2015·Granted Sep 18, 2018·9 cites·20 claims
- 0693US9627368B2Semiconductor device using EMC wafer support system and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2013·Granted Apr 18, 2017·11 cites·19 claims
- 0792US7446422B1Wafer level chip scale package and manufacturing method for the sameAMKOR TECHNOLOGY INC·Filed 2005·Granted Nov 4, 2008·26 cites·7 claims
- 0892US6953988B2Semiconductor packageAMKOR TECHNOLOGY INC·Filed 2004·Granted Oct 11, 2005·60 cites·16 claims
- 0991US9966276B2Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted May 8, 2018·5 cites·20 claims
- 1090US10297466B2Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2018·Granted May 21, 2019·4 cites·20 claims
- 1189US2025349817A1Semiconductor device using emc wafer support system and fabricating method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2025·Application pending·0 cites
- 1287US7362038B1Surface acoustic wave (SAW) device package and method for packaging a SAW deviceAMKOR TECHNOLOGY INC·Filed 2005·Granted Apr 22, 2008·15 cites·19 claims
- 1385US9536858B2Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2015·Granted Jan 3, 2017·3 cites·20 claims
- 1483US9478517B2Electronic device package structure and method of fabricating the sameAMKOR TECHNOLOGY INC·Filed 2013·Granted Oct 25, 2016·6 cites·20 claims
- 1583US2024266189A1Semiconductor device and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 1682US11101144B2Semiconductor device and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2019·Granted Aug 24, 2021·2 cites·21 claims
- 1781US10388643B2Semiconductor device using EMC wafer support system and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted Aug 20, 2019·2 cites·20 claims
- 1880US5740956ABonding method for semiconductor chipsANAM IND CO LTD·Filed 1995·Granted Apr 21, 1998·86 cites·5 claims
- 1976US12362343B2Semiconductor device using EMC wafer support system and fabricating method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Jul 15, 2025·0 cites·25 claims
- 2075US11501978B2Semiconductor device and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Nov 15, 2022·0 cites·20 claims
- 2175US6841874B1Wafer-level chip-scale packageAMKOR TECHNOLOGY INC·Filed 2002·Granted Jan 11, 2005·19 cites·17 claims
- 2274US11961742B2Semiconductor device and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Apr 16, 2024·0 cites·18 claims
- 2373US7359579B1Image sensor package and its manufacturing methodAMKOR TECHNOLOGY INC·Filed 2004·Granted Apr 15, 2008·19 cites·20 claims
- 2472US6987319B1Wafer-level chip-scale packageAMKOR TECHNOLOGY INC·Filed 2004·Granted Jan 17, 2006·15 cites·20 claims
- 2571US9104937B2Apparatus and method for recognizing image with increased image recognition rateSAMSUNG ELECTRONICS CO LTD·Filed 2012·Granted Aug 11, 2015·2 cites·13 claims
- 2670US9423910B2Display device having pattern and method of detecting pixel position thereinSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Aug 23, 2016·2 cites·12 claims
- 2770US9196601B2Semiconductor deviceAMKOR TECHNOLOGY INC·Filed 2013·Granted Nov 24, 2015·3 cites·20 claims
- 2869US9502375B2Semiconductor device with plated pillars and leadsAMKOR TECHNOLOGY INC·Filed 2013·Granted Nov 22, 2016·2 cites·17 claims
- 2965US9449946B2Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2014·Granted Sep 20, 2016·2 cites·17 claims
- 3064US11183493B2Semiconductor device using EMC wafer support system and fabricating method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2019·Granted Nov 23, 2021·0 cites·13 claims
- 3164US10985031B2Semiconductor device and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2019·Granted Apr 20, 2021·0 cites·21 claims
- 3264US8055299B2Mobile input device of mobile terminalSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Nov 8, 2011·3 cites·13 claims
- 3359US10515825B2Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2018·Granted Dec 24, 2019·0 cites·20 claims
- 3454US9454246B2Multi-functional pen and method for using multi-functional penSEO SEONG-MIN·Filed 2011·Granted Sep 27, 2016·1 cites·13 claims
- 3551US2023073007A1Switching binder, preparation method therefor, and pharmaceutical composition, assay kit, and antigen and antibody assay method, each using sameOPTOLANE TECH INC·Filed 2020·Application pending·0 cites
- 3650US9048241B2Semiconductor device utilzing redistribution layers to couple stacked diePAEK JONG SIK·Filed 2013·Granted Jun 2, 2015·0 cites·20 claims
- 3750US2010141606A1Method for providing haptic feedback in a touch screenSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 3849US5858149AProcess for bonding semiconductor chipANAM SEMICONDUCTOR INC·Filed 1996·Granted Jan 12, 1999·14 cites·4 claims
- 3949US2016162047A1Pen-type input device and input method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
- 4047US2013082907A1Display apparatus including a pattern and method for generating aSAMSUNG ELECTRONICS CO LTD·Filed 2012·Application pending·0 cites
- 4144US9946372B2Pen type input device and method for character input and mouse functionsRHEE DO YOUNG·Filed 2010·Granted Apr 17, 2018·0 cites·16 claims
- 4242US2008074156A1Current driving type light source driving circuitSEO JA-WON·Filed 2007·Application pending·0 cites
- 4341US2015021767A1Semiconductor device with plated conductive pillar couplingPARK DOO HYUN·Filed 2013·Application pending·0 cites
- 4441US2007104426A1Bi-directional optical transceiverSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 4539US2011157052A1Method and apparatus for generating vibrations in portable terminalSAMSUNG ELECTRONICS CO LTD·Filed 2010·Application pending·0 cites
- 4639US2007018322A1Wafer level package and its manufacturing methodAMKOR TECHNOLOGY INC·Filed 2004·Application pending·0 cites
- 4738US2006261458A1Semiconductor package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →