Inventor · disambiguated record
Krystyna W. Semkow
Also filed as: SEMKOW KRYSTYNA · SEMKOW KRYSTYNA W · SEMKOW KRYSTYNA WALERIA
51 granted patents·8 pending applications·718 citations·filing 1987–2019
98Inventor score
Top patents by PatentIndex Score
59 records- 0196US8177945B2Multi-anode system for uniform plating of alloysARVIN CHARLES L·Filed 2007·Granted May 15, 2012·17 cites·20 claims
- 0296US5846598AElectroless plating of metallic features on nonmetallic or semiconductor layer without extraneous platingIBM·Filed 1997·Granted Dec 8, 1998·269 cites·4 claims
- 0394US9472520B2Multilayer pillar for reduced stress interconnect and method of making sameJADHAV VIRENDRA R·Filed 2012·Granted Oct 18, 2016·14 cites·19 claims
- 0493US11244917B2Multilayer pillar for reduced stress interconnect and method of making sameIBM·Filed 2019·Granted Feb 8, 2022·4 cites·11 claims
- 0593US8803317B2Structures for improving current carrying capability of interconnects and methods of fabricating the sameARVIN CHARLES L·Filed 2012·Granted Aug 12, 2014·5 cites·15 claims
- 0691US10403590B2Multilayer pillar for reduced stress interconnect and method of making sameIBM·Filed 2017·Granted Sep 3, 2019·4 cites·9 claims
- 0791US9084378B2Under ball metallurgy (UBM) for improved electromigrationIBM·Filed 2013·Granted Jul 14, 2015·11 cites·16 claims
- 0889US6060176ACorrosion protection for metallic featuresIBM·Filed 1997·Granted May 9, 2000·96 cites·21 claims
- 0988US10396051B2Multilayer pillar for reduced stress interconnect and method of making sameIBM·Filed 2017·Granted Aug 27, 2019·3 cites·13 claims
- 1088US9379007B2Electromigration-resistant lead-free solder interconnect structuresGLOBALFOUNDRIES INC·Filed 2013·Granted Jun 28, 2016·10 cites·20 claims
- 1187US8293587B2Multilayer pillar for reduced stress interconnect and method of making sameJADHAV VIRENDRA R·Filed 2007·Granted Oct 23, 2012·9 cites·19 claims
- 1284US4804448AApparatus for simultaneous generation of alkali metal species and oxygen gasELTRON RESEARCH INC·Filed 1987·Granted Feb 14, 1989·30 cites·18 claims
- 1383US8610283B2Semiconductor device having a copper plugFAROOQ MUKTA G·Filed 2009·Granted Dec 17, 2013·7 cites·12 claims
- 1481US8232655B2Bump pad metallurgy employing an electrolytic Cu / electorlytic Ni / electrolytic Cu stackARVIN CHARLES L·Filed 2008·Granted Jul 31, 2012·9 cites·20 claims
- 1579US9035459B2Structures for improving current carrying capability of interconnects and methods of fabricating the sameARVIN CHARLES L·Filed 2009·Granted May 19, 2015·1 cites·10 claims
- 1679US5098533AElectrolytic method for the etch back of encapsulated copper-Invar-copper core structuresIBM·Filed 1991·Granted Mar 24, 1992·66 cites·10 claims
- 1776US8298929B2Offset solder vias, methods of manufacturing and design structuresDAUBENSPECK TIMOTHY H·Filed 2010·Granted Oct 30, 2012·4 cites·6 claims
- 1876US7897059B2High tin solder etching solutionIBM·Filed 2007·Granted Mar 1, 2011·4 cites·18 claims
- 1976US5896869ASemiconductor package having etched-back silver-copper brazeIBM·Filed 1997·Granted Apr 27, 1999·51 cites·11 claims
- 2071US8025812B2Selective etch of TiW for capture pad formationIBM·Filed 2007·Granted Sep 27, 2011·5 cites·8 claims
- 2169US8493746B2Additives for grain fragmentation in Pb-free Sn-based solderARVIN CHARLES L·Filed 2010·Granted Jul 23, 2013·2 cites·14 claims
- 2268US11094657B2Multilayer pillar for reduced stress interconnect and method of making sameIBM·Filed 2019·Granted Aug 17, 2021·0 cites·14 claims
- 2368US8623194B2Multi-anode system for uniform plating of alloysARVIN CHARLES L·Filed 2012·Granted Jan 7, 2014·0 cites·18 claims
- 2466US11171102B2Multilayer pillar for reduced stress interconnect and method of making sameIBM·Filed 2019·Granted Nov 9, 2021·0 cites·13 claims
- 2566US8551303B2Multi-anode system for uniform plating of alloysARVIN CHARLES L·Filed 2012·Granted Oct 8, 2013·0 cites·20 claims
- 2666US7425278B2Process of etching a titanium/tungsten surface and etchant used thereinIBM·Filed 2006·Granted Sep 16, 2008·2 cites·6 claims
- 2766US7287468B2Nickel alloy plated structureIBM·Filed 2005·Granted Oct 30, 2007·3 cites·26 claims
- 2864US8674506B2Structures and methods to reduce maximum current density in a solder ballIBM·Filed 2013·Granted Mar 18, 2014·1 cites·13 claims
- 2963US9142501B2Under ball metallurgy (UBM) for improved electromigrationIBM·Filed 2014·Granted Sep 22, 2015·1 cites·23 claims
- 3063US8446006B2Structures and methods to reduce maximum current density in a solder ballBEZAMA RASCHID J·Filed 2009·Granted May 21, 2013·2 cites·22 claims
- 3162US9640501B2Multilayer pillar for reduced stress interconnect and method of making sameIBM·Filed 2014·Granted May 2, 2017·0 cites·19 claims
- 3262US7294909B2Electronic package repair processIBM·Filed 2005·Granted Nov 13, 2007·2 cites·14 claims
- 3358US2012328789A1Metal-graphite foam composite and a cooling apparatus for using the sameLU MINHUA·Filed 2012·Application pending·0 cites
- 3457US7472650B2Nickel alloy plated structureIBM·Filed 2007·Granted Jan 6, 2009·1 cites·12 claims
- 3556US9111816B2Multilayer pillar for reduced stress interconnect and method of making sameJADHAV VIRENDRA R·Filed 2012·Granted Aug 18, 2015·0 cites·18 claims
- 3655US8741769B2Semiconductor device having a copper plugIBM·Filed 2013·Granted Jun 3, 2014·0 cites·7 claims
- 3755US6838009B2Rework method for finishing metallurgy on chip carriersIBM·Filed 2001·Granted Jan 4, 2005·6 cites·5 claims
- 3854US8749059B2Semiconductor device having a copper plugFAROOQ MUKTA G·Filed 2012·Granted Jun 10, 2014·0 cites·7 claims
- 3954US5560840ASelective etching of nickle/iron alloysIBM·Filed 1994·Granted Oct 1, 1996·12 cites·9 claims
- 4054US2008166492A1Metal-graphite foam composite and a cooling apparatus for using the sameIBM·Filed 2007·Application pending·0 cites
- 4153US8910853B2Additives for grain fragmentation in Pb-free Sn-based solderIBM·Filed 2013·Granted Dec 16, 2014·0 cites·17 claims
- 4253US6501174B2Interconnect structure for surface mounted devicesIBM·Filed 2001·Granted Dec 31, 2002·5 cites·12 claims
- 4353US5989443ASelective etching of nickle/iron alloysIBM·Filed 1997·Granted Nov 23, 1999·7 cites·9 claims
- 4451US8922019B2Semiconductor device having a copper plugINTERNATINOAL BUSINESS MACHINES CORP·Filed 2013·Granted Dec 30, 2014·0 cites·21 claims
- 4550US8587112B2Underbump metallurgy employing an electrolytic Cu / electorlytic Ni / electrolytic Cu stackARVIN CHARLES L·Filed 2012·Granted Nov 19, 2013·0 cites·20 claims
- 4650US5108562AElectrolytic method for forming vias and through holes in copper-invar-copper core structuresIBM·Filed 1991·Granted Apr 28, 1992·21 cites·13 claims
- 4747US6823585B2Method of selective plating on a substrateIBM·Filed 2003·Granted Nov 30, 2004·2 cites·13 claims
- 4847US5374338ASelective electroetch of copper and other metalsIBM·Filed 1993·Granted Dec 20, 1994·10 cites·10 claims
- 4946US5723062ASelective etching of nickle/iron alloysIBM·Filed 1996·Granted Mar 3, 1998·8 cites·10 claims
- 5046US2013249066A1Electromigration-resistant lead-free solder interconnect structuresARVIN CHARLES L·Filed 2012·Application pending·0 cites
Showing the top 50 of 59 patent records by PatentIndex Score.
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