Inventor · disambiguated record
Bryan Peng
Also filed as: PENG BRYAN
8 granted patents·1 pending application·309 citations·filing 2000–2024
91Inventor score
Top patents by PatentIndex Score
9 records- 0197US8148806B2Multiple chips bonded to packaging structure with low noise and multiple selectable functionsLIN MOU-SHIUNG·Filed 2008·Granted Apr 3, 2012·46 cites·34 claims
- 0297US7045901B2Chip-on-chip connection with second chip located in rectangular open window hole in printed circuit boardMEGIC CORP·Filed 2003·Granted May 16, 2006·91 cites·8 claims
- 0396US7247932B1Chip package with capacitorMEGICA CORP·Filed 2000·Granted Jul 24, 2007·67 cites·56 claims
- 0494US6768208B2Multiple chips bonded to packaging structure with low noise and multiple selectable functionsMEGIC CORP·Filed 2003·Granted Jul 27, 2004·52 cites·4 claims
- 0585US12146971B2Systems and methods for determining absolute velocity and position of a sensor device for measuring fluid and fluid conduit propertiesINGU SOLUTIONS INC·Filed 2022·Granted Nov 19, 2024·1 cites·11 claims
- 0685US7205646B2Electronic device and chip packageMEGIC CORP·Filed 2003·Granted Apr 17, 2007·20 cites·34 claims
- 0781US7468551B2Multiple chips bonded to packaging structure with low noise and multiple selectable functionsMEGICA CORP·Filed 2003·Granted Dec 23, 2008·16 cites·14 claims
- 0881US6791192B2Multiple chips bonded to packaging structure with low noise and multiple selectable functionsMEGIC CORP·Filed 2003·Granted Sep 14, 2004·16 cites·8 claims
- 0975US2025052850A1Systems and methods for determining absolute velocity and position of a sensor device for measuring fluid and fluid conduit propertiesINGU SOLUTIONS INC·Filed 2024·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →