Inventor
MAI QUANG X
US9 patents
⚠️ This page may combine multiple inventors who share the name “MAI QUANG X”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TEXAS INSTRUMENTS INC
8 patentsUS6683380B2Jan 27, 2004
Integrated circuit with bonding layer over active circuitry
TEXAS INSTRUMENTS INC274 citations98
US6020640AFeb 1, 2000
Thick plated interconnect and associated auxillary interconnect
TEXAS INSTRUMENTS INC174 citations98
US6025275AFeb 15, 2000
Method of forming improved thick plated copper interconnect and associated auxiliary metal interconnect
TEXAS INSTRUMENTS INC90 citations97
US7335536B2Feb 26, 2008
Method for fabricating low resistance, low inductance interconnections in high current semiconductor devices
TEXAS INSTRUMENTS INC49 citations95
US6140702AOct 31, 2000
Plastic encapsulation for integrated circuits having plated copper top surface level interconnect
TEXAS INSTRUMENTS INC28 citations92
US6140150AOct 31, 2000
Plastic encapsulation for integrated circuits having plated copper top surface level interconnect
TEXAS INSTRUMENTS INC15 citations73
USRE48420EFeb 2, 2021
Method for fabricating low resistance, low inductance interconnections in high current semiconductor devices
TEXAS INSTRUMENTS INC0 citations62
USRE46618ENov 28, 2017
Method for fabricating low resistance, low inductance interconnections in high current semiconductor devices
TEXAS INSTRUMENTS INC0 citations51