Inventor

LEE JONG-JOO

KR51 patents

⚠️ This page may combine multiple inventors who share the name “LEE JONG-JOO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEE JONG-JOO

SAMSUNG ELECTRONICS CO LTD

Stack chip and stack chip package having the same

Stack chip and stack chip package having the same

Semiconductor package having heat spreader and package stack using the same

Multi-chip ball grid array package

Planar multi semiconductor chip package and method of manufacturing the same

Chip stack, chip stack package, and method of forming chip stack and chip stack package

Semiconductor device package having buffered memory module and method thereof

Package board having internal terminal interconnection and semiconductor package employing the same

Semiconductor package including redistribution pattern and method of manufacturing the same

Packaged semiconductor die and manufacturing method thereof

Semiconductor chips having redistributed power/ground lines directly connected to power/ground lines of internal circuits and methods of fabricating the same

Semiconductor package and method of manufacturing the semiconductor package

Semiconductor package and method of manufacturing the semiconductor package

Integrated circuit card socket having a terminal with a loop-shaped portion

Multi-chip package and method of manufacturing the same

Chip stack package

Test apparatus having intermediate connection board for package

Semiconductor memory package

Printed circuit board having coplanar LC balance

Semiconductor chip package and printed circuit board having through interconnections

Semiconductor package module without a solder ball and method of manufacturing the semiconductor package module

LEE JONG-JOO

Three-dimensional stacked structure semiconductor device having through-silicon via and signaling method for the semiconductor device

Semiconductor package

Semiconductor chips having redistributed power/ground lines directly connected to power/ground lines of internal circuits and methods of fabricating the same

Planar multi semiconductor chip package

Package board having internal terminal interconnection and semiconductor package employing the same

Semiconductor package and method of manufacturing the same

Package substrate having main dummy pattern located in path of stress

Electronic device having optical communicating part

Semiconductor chip including a chip via plug penetrating a substrate, a semiconductor stack, a semiconductor device package and an electronic apparatus including the semiconductor chip

Semiconductor chips having redistributed power/ground lines directly connected to power/ground lines of internal circuits and methods of fabricating the same

Method of manufacturing stacked semiconductor package

Semiconductor chip including a chip via plug penetrating a substrate, a semiconductor stack, a semiconductor device package and an electronic apparatus including the semiconductor chip

Semiconductor chips having redistributed power/ground lines directly connected to power/ground lines of internal circuits and methods of fabricating the same

Flip chip package

Package-on-package type package including integrated circuit devices and associated passive components on different levels

High I/O semiconductor chip package and method of manufacturing the same

Flip chip package

Method of fabricating a circuit board and semiconductor package.

SK HYNIX INC

Memory system including a sub-controller and operating method of the sub-controller

Memory system including a sub-controller and operating method of the sub-controller

Storage device based on daisy chain topology

Semiconductor package including stacked semiconductor chips

SHIN DONG-KIL

Semiconductor device having a conductive bump

KANG UN-BYOUNG

Multi-chip package and method of manufacturing the same

SK SILTRON CO LTD

Wafer cassette stocker and wafer cassette drying method using the same

BAEK SEUNG-DUK

Stack package

LEE JONG JOO

Package-on-package type package including integrated circuit devices and associated passive components on different levels

KANG SUN-WON

Chip stack package

KIM YONG-HOON

Semiconductor device including coupling conductive pattern