Inventor
MASHINO MICHIO
JP19 patents
⚠️ This page may combine multiple inventors who share the name “MASHINO MICHIO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TANIGUCHI KOUHEI
9 patentsUSD680505SApr 23, 2013
Adhesive tape for semiconductor manufacturing
TANIGUCHI KOUHEI15 citations91
USD664512SJul 31, 2012
Adhesive tape for semiconductor manufacturing
TANIGUCHI KOUHEI27 citations91
USD664511SJul 31, 2012
Adhesive tape for semiconductor manufacturing
TANIGUCHI KOUHEI26 citations91
USD656909SApr 3, 2012
Adhesive tape for semiconductor manufacturing
TANIGUCHI KOUHEI28 citations91
USD656910SApr 3, 2012
Adhesive tape for semiconductor manufacturing
TANIGUCHI KOUHEI38 citations91
USD690278SSep 24, 2013
Adhesive tape for semiconductor manufacturing
TANIGUCHI KOUHEI13 citations83
USD689831SSep 17, 2013
Adhesive tape for semiconductor manufacturing
TANIGUCHI KOUHEI9 citations83
US9076832B2Jul 7, 2015
Wafer processing tape, method of manufacturing wafer processing tape, and method of manufacturing semiconductor device
TANIGUCHI KOUHEI1 citations61
US9076833B2Jul 7, 2015
Tape for processing wafer, method for manufacturing tape for processing wafer, and method for manufacturing semiconductor device
TANIGUCHI KOUHEI0 citations51
HITACHI CHEMICAL CO LTD
6 patentsUS7968195B2Jun 28, 2011
Dicing tape laminated with adhesive sheet of polymer, epoxy resin and filler
HITACHI CHEMICAL CO LTD18 citations92
US7968194B2Jun 28, 2011
Dicing tape laminated with adhesive sheet of polymer, thermosetting resin and filler
HITACHI CHEMICAL CO LTD19 citations92
US7875500B2Jan 25, 2011
Bonding semiconductor wafer stuck on dicing tape laminated adhesive sheet onto mounting support
HITACHI CHEMICAL CO LTD25 citations92
US8017444B2Sep 13, 2011
Adhesive sheet, semiconductor device, and process for producing semiconductor device
HITACHI CHEMICAL CO LTD8 citations81
USD804435SDec 5, 2017
Flap in an adhesive tape for semiconductor manufacturing
HITACHI CHEMICAL CO LTD5 citations72
US9190309B2Nov 17, 2015
Tape for processing wafer, method for manufacturing tape for processing
HITACHI CHEMICAL CO LTD0 citations51
TANAKA MAIKO
2 patentsUS8470115B2Jun 25, 2013
Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device
TANAKA MAIKO8 citations81
US8465615B2Jun 18, 2013
Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device
TANAKA MAIKO8 citations81