Inventor

KATOU RIE

JP13 patents

⚠️ This page may combine multiple inventors who share the name “KATOU RIE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TANIGUCHI KOUHEI

9 patents

USD680505SApr 23, 2013

Adhesive tape for semiconductor manufacturing

TANIGUCHI KOUHEI15 citations91

USD664512SJul 31, 2012

Adhesive tape for semiconductor manufacturing

TANIGUCHI KOUHEI27 citations91

USD664511SJul 31, 2012

Adhesive tape for semiconductor manufacturing

TANIGUCHI KOUHEI26 citations91

USD656909SApr 3, 2012

Adhesive tape for semiconductor manufacturing

TANIGUCHI KOUHEI28 citations91

USD656910SApr 3, 2012

Adhesive tape for semiconductor manufacturing

TANIGUCHI KOUHEI38 citations91

USD690278SSep 24, 2013

Adhesive tape for semiconductor manufacturing

TANIGUCHI KOUHEI13 citations83

USD689831SSep 17, 2013

Adhesive tape for semiconductor manufacturing

TANIGUCHI KOUHEI9 citations83

US9076832B2Jul 7, 2015

Wafer processing tape, method of manufacturing wafer processing tape, and method of manufacturing semiconductor device

TANIGUCHI KOUHEI1 citations61

US9076833B2Jul 7, 2015

Tape for processing wafer, method for manufacturing tape for processing wafer, and method for manufacturing semiconductor device

TANIGUCHI KOUHEI0 citations51

HITACHI CHEMICAL CO LTD

2 patents

USD804435SDec 5, 2017

Flap in an adhesive tape for semiconductor manufacturing

HITACHI CHEMICAL CO LTD5 citations72

US9190309B2Nov 17, 2015

Tape for processing wafer, method for manufacturing tape for processing

HITACHI CHEMICAL CO LTD0 citations51

KATOU RIE

1 patent

US8975161B2Mar 10, 2015

Dicing/die bonding integral film, dicing/die bonding integral film manufacturing method, and semiconductor chip manufacturing method

KATOU RIE6 citations67

FURUTANI RYOJI

1 patent

US9011624B2Apr 21, 2015

Adhesive sheet and method for manufacturing adhesive sheets

FURUTANI RYOJI2 citations52