Inventor

LANGE BERNHARD P

DE17 patents

⚠️ This page may combine multiple inventors who share the name “LANGE BERNHARD P”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LANGE BERNHARD P

TEXAS INSTRUMENTS INC

Bond capillary design for ribbon wire bonding

Method for fabricating low resistance, low inductance interconnections in high current semiconductor devices

Bond capillary design for ribbon wire bonding

Non-pull back pad package with an additional solder standoff

Flip chip package with advanced electrical and thermal properties for high current designs

Flip chip package with advanced electrical and thermal properties for high current designs

Semiconductor device having firmly secured heat spreader

Method for fabricating low resistance, low inductance interconnections in high current semiconductor devices

Multi lead frame power package

High current semiconductor device system having low resistance and inductance

Semiconductor device with improved high current performance

Semiconductor assembly and packaging for high current and low inductance

Heatsink apparatus and thermally-conductive intermediate material for dissipating heat in semiconductor packages

Method for fabricating low resistance, low inductance interconnections in high current semiconductor devices

LANGE BERNHARD P

Method for fabricating low resistance, low inductance interconnections in high current semiconductor devices

Non-pull back pad package with an additional solder standoff

WIKTOR STEFAN W

High power integrated circuit device having bump pads