Inventor · disambiguated record
Bob Kong
Also filed as: KONG BOB · KONG BOB WEN · KONG BOB WEN Z · KONG BOB WEN ZHONG
10 granted patents·3 pending applications·121 citations·filing 2003–2013
89Inventor score
Top patents by PatentIndex Score
13 records- 0190US6797312B2Electroless plating solution and processMATTSON TECH INC·Filed 2003·Granted Sep 28, 2004·66 cites·18 claims
- 0287US7968462B1Noble metal activation layerINTERMOLECULAR INC·Filed 2008·Granted Jun 28, 2011·10 cites·24 claims
- 0382US8859427B2Formation of a zinc passivation layer on titanium or titanium alloys used in semiconductor processingKONG BOB·Filed 2011·Granted Oct 14, 2014·4 cites·3 claims
- 0481US8545998B2Electroless deposition of platinum on copperKONG BOB·Filed 2011·Granted Oct 1, 2013·4 cites·15 claims
- 0581US6873039B2Methods of making microelectronic packages including electrically and/or thermally conductive elementTESSERA INC·Filed 2003·Granted Mar 29, 2005·29 cites·7 claims
- 0674US8728879B2Formation of a zinc passivation layer on titanium or titanium alloys used in semiconductor processingKONG BOB·Filed 2012·Granted May 20, 2014·2 cites·18 claims
- 0771US8278215B2Noble metal activation layerSUN ZHI-WEN·Filed 2011·Granted Oct 2, 2012·2 cites·15 claims
- 0870US8143164B2Formation of a zinc passivation layer on titanium or titanium alloys used in semiconductor processingKONG BOB·Filed 2009·Granted Mar 27, 2012·2 cites·4 claims
- 0969US9023137B2Electroless deposition of platinum on copperINTERMOLECULAR INC·Filed 2013·Granted May 5, 2015·1 cites·20 claims
- 1061US8551560B2Methods for improving selectivity of electroless deposition processesTONG JINHONG·Filed 2009·Granted Oct 8, 2013·1 cites·12 claims
- 1157US2013125974A1Solar cell with metal grid fabricated by electroplatingSILEVO INC·Filed 2012·Application pending·0 cites
- 1255US2010055422A1Electroless Deposition of Platinum on CopperKONG BOB·Filed 2008·Application pending·0 cites
- 1344US2005167814A1Method of making microelectronic packages including electrically and/or thermally conductive elementTESSERA INC·Filed 2005·Application pending·0 cites
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