Inventor · disambiguated record
Ching-Mei Hsu
Also filed as: HSU CHING-MEI
26 granted patents·4 pending applications·3,226 citations·filing 1998–2021
98Inventor score
Top patents by PatentIndex Score
30 records- 0198US9991134B2Processing systems and methods for halide scavengingAPPLIED MATERIALS INC·Filed 2014·Granted Jun 5, 2018·100 cites·17 claims
- 0298US9881805B2Silicon selective removalAPPLIED MATERIALS INC·Filed 2016·Granted Jan 30, 2018·110 cites·16 claims
- 0398US9704723B2Processing systems and methods for halide scavengingAPPLIED MATERIALS INC·Filed 2015·Granted Jul 11, 2017·114 cites·17 claims
- 0498US9659792B2Processing systems and methods for halide scavengingAPPLIED MATERIALS INC·Filed 2015·Granted May 23, 2017·125 cites·13 claims
- 0598US9502258B2Anisotropic gap etchAPPLIED MATERIALS INC·Filed 2014·Granted Nov 22, 2016·129 cites·14 claims
- 0698US9449850B2Processing systems and methods for halide scavengingAPPLIED MATERIALS INC·Filed 2015·Granted Sep 20, 2016·135 cites·18 claims
- 0798US9449845B2Selective titanium nitride etchingAPPLIED MATERIALS INC·Filed 2014·Granted Sep 20, 2016·138 cites·19 claims
- 0898US9437451B2Radical-component oxide etchAPPLIED MATERIALS INC·Filed 2015·Granted Sep 6, 2016·134 cites·19 claims
- 0998US9412608B2Dry-etch for selective tungsten removalAPPLIED MATERIALS INC·Filed 2015·Granted Aug 9, 2016·134 cites·17 claims
- 1098US9378969B2Low temperature gas-phase carbon removalAPPLIED MATERIALS INC·Filed 2014·Granted Jun 28, 2016·529 cites·14 claims
- 1198US9184055B2Processing systems and methods for halide scavengingAPPLIED MATERIALS INC·Filed 2014·Granted Nov 10, 2015·181 cites·20 claims
- 1298US9153442B2Processing systems and methods for halide scavengingAPPLIED MATERIALS INC·Filed 2014·Granted Oct 6, 2015·220 cites·13 claims
- 1398US9093371B2Processing systems and methods for halide scavengingAPPLIED MATERIALS INC·Filed 2014·Granted Jul 28, 2015·184 cites·17 claims
- 1498US9023732B2Processing systems and methods for halide scavengingAPPLIED MATERIALS INC·Filed 2014·Granted May 5, 2015·187 cites·14 claims
- 1598US9023734B2Radical-component oxide etchAPPLIED MATERIALS INC·Filed 2013·Granted May 5, 2015·182 cites·19 claims
- 1698US8980763B2Dry-etch for selective tungsten removalAPPLIED MATERIALS INC·Filed 2013·Granted Mar 17, 2015·206 cites·14 claims
- 1798US8921234B2Selective titanium nitride etchingAPPLIED MATERIALS INC·Filed 2013·Granted Dec 30, 2014·187 cites·21 claims
- 1897US9064816B2Dry-etch for selective oxidation removalAPPLIED MATERIALS INC·Filed 2013·Granted Jun 23, 2015·188 cites·18 claims
- 1982US11211286B2Airgap formation processesAPPLIED MATERIALS INC·Filed 2019·Granted Dec 28, 2021·3 cites·16 claims
- 2079US11417534B2Selective material removalAPPLIED MATERIALS INC·Filed 2018·Granted Aug 16, 2022·2 cites·15 claims
- 2177US8896077B2Optoelectronic semiconductor device and method of fabricationCUI YI·Filed 2010·Granted Nov 25, 2014·2 cites·32 claims
- 2277US8394550B2Nano-patterned electrolytes in solid oxide fuel cellsCHAO CHENG-CHIEH·Filed 2010·Granted Mar 12, 2013·3 cites·13 claims
- 2376US5960996AGas-burned glue gunFiled 1998·Granted Oct 5, 1999·28 cites·9 claims
- 2465US11735467B2Airgap formation processesAPPLIED MATERIALS INC·Filed 2021·Granted Aug 22, 2023·0 cites·3 claims
- 2562US8318604B2Substrate comprising a nanometer-scale projection arrayCUI YI·Filed 2010·Granted Nov 27, 2012·1 cites·30 claims
- 2662US2014271097A1Processing systems and methods for halide scavengingAPPLIED MATERIALS INC·Filed 2014·Application pending·0 cites
- 2760US2016027673A1Processing systems and methods for halide scavengingAPPLIED MATERIALS INC·Filed 2015·Application pending·0 cites
- 2853US2010200537A1Nano-patterned metal electrode for solid oxide fuel cellKIM YOUNG BEOM·Filed 2009·Application pending·0 cites
- 2945US2015311089A1Dry-etch for selective oxidation removalAPPLIED MATERIALS INC·Filed 2015·Application pending·0 cites
- 3038USD435081SGas spray gunHSU CHING-MEI·Filed 1998·Granted Dec 12, 2000·4 cites·1 claims
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