Inventor

COYLE ANTHONY L

US24 patents

⚠️ This page may combine multiple inventors who share the name “COYLE ANTHONY L”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

COYLE ANTHONY L

TEXAS INSTRUMENTS INC

Plastic package for micromechanical devices

Flip chip semiconductor device in a molded chip scale package (CSP) and method of assembly

Method of fabricating a molded package for micromechanical devices

Method for fabricating low resistance, low inductance interconnections in high current semiconductor devices

Method of fabricating a molded package for micromechanical devices

Molded package for micromechanical devices and method of fabrication

Contact structure for reliable metallic interconnection

Non-pull back pad package with an additional solder standoff

Flip chip package with advanced electrical and thermal properties for high current designs

Flip chip package with advanced electrical and thermal properties for high current designs

Flip chip semiconductor device in a molded chip scale package

Integrated circuit chip packaging assembly

Plastic chip-scale package having integrated passive components

Method for fabricating low resistance, low inductance interconnections in high current semiconductor devices

Multi lead frame power package

High current semiconductor device system having low resistance and inductance

Plastic chip-scale package having integrated passive components

Semiconductor package having integrated metal parts for thermal enhancement

Method for fabricating low resistance, low inductance interconnections in high current semiconductor devices

Integrated circuit chip packaging assembly

Thermally enhanced single inline package (SIP)

LANGE BERNHARD P

Method for fabricating low resistance, low inductance interconnections in high current semiconductor devices

Non-pull back pad package with an additional solder standoff

WIKTOR STEFAN W

High power integrated circuit device having bump pads