Inventor
LEE TSUNG-LIN
TW138 patents
⚠️ This page may combine multiple inventors who share the name “LEE TSUNG-LIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
16 patentsUS10374059B2Aug 6, 2019
Structure and formation method of semiconductor device structure with nanowires
TAIWAN SEMICONDUCTOR MFG CO LTD14 citations94
US9564529B2Feb 7, 2017
Method for fabricating a strained structure and structure formed
TAIWAN SEMICONDUCTOR MFG CO LTD10 citations93
US11508831B2Nov 22, 2022
Gate spacer structure and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US10868142B2Dec 15, 2020
Gate spacer structure and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US10522409B2Dec 31, 2019
Fin field effect transistor (FinFET) device structure with dummy fin structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US10062782B2Aug 28, 2018
Method of manufacturing a semiconductor device with multilayered channel structure
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US9847334B1Dec 19, 2017
Structure and formation method of semiconductor device with channel layer
TAIWAN SEMICONDUCTOR MFG CO LTD17 citations84
US9647071B2May 9, 2017
FINFET structures and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD11 citations84
US9419134B2Aug 16, 2016
Strain enhancement for FinFETs
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US12199169B2Jan 14, 2025
Structure and formation method of semiconductor device structure with nanowires
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations75
US11984489B2May 14, 2024
Air spacer for a gate structure of a transistor
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11855207B2Dec 26, 2023
FinFET structure and method with reduced fin buckling
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11411107B2Aug 9, 2022
FinFET structure and method with reduced fin buckling
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11158742B2Oct 26, 2021
Method of manufacturing a semiconductor device with multilayered channel structure
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11088022B2Aug 10, 2021
Different isolation liners for different type FinFETs and associated isolation feature fabrication
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10991811B2Apr 27, 2021
Structure and formation method of semiconductor device structure with nanowires
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
TAIWAN SEMICONDUCTOR MFG
15 patentsUS8373238B2Feb 12, 2013
FinFETs with multiple Fin heights
TAIWAN SEMICONDUCTOR MFG39 citations98
US7176084B2Feb 13, 2007
Self-aligned conductive spacer process for sidewall control gate of high-speed random access memory
TAIWAN SEMICONDUCTOR MFG66 citations98
US9147594B2Sep 29, 2015
Method for fabricating a strained structure
TAIWAN SEMICONDUCTOR MFG13 citations93
US8748993B2Jun 10, 2014
FinFETs with multiple fin heights
TAIWAN SEMICONDUCTOR MFG18 citations93
US8673709B2Mar 18, 2014
FinFETs with multiple fin heights
TAIWAN SEMICONDUCTOR MFG17 citations93
US7482236B2Jan 27, 2009
Structure and method for a sidewall SONOS memory device
TAIWAN SEMICONDUCTOR MFG39 citations92
US9257344B2Feb 9, 2016
FinFETs with different fin height and EPI height setting
TAIWAN SEMICONDUCTOR MFG5 citations84
US9112052B2Aug 18, 2015
Voids in STI regions for forming bulk FinFETs
TAIWAN SEMICONDUCTOR MFG10 citations84
US9087725B2Jul 21, 2015
FinFETs with different fin height and EPI height setting
TAIWAN SEMICONDUCTOR MFG11 citations84
US8878308B2Nov 4, 2014
Multi-fin device by self-aligned castle fin formation
TAIWAN SEMICONDUCTOR MFG8 citations84
US8846466B2Sep 30, 2014
Forming inter-device STI regions and intra-device STI regions using different dielectric materials
TAIWAN SEMICONDUCTOR MFG5 citations84
US8846465B2Sep 30, 2014
Integrated circuit with multi recessed shallow trench isolation
TAIWAN SEMICONDUCTOR MFG8 citations84
US8747992B2Jun 10, 2014
Non-uniform semiconductor device active area pattern formation
TAIWAN SEMICONDUCTOR MFG5 citations84
US8723271B2May 13, 2014
Voids in STI regions for forming bulk FinFETs
TAIWAN SEMICONDUCTOR MFG12 citations84
US7511988B2Mar 31, 2009
Static noise-immune SRAM cells
TAIWAN SEMICONDUCTOR MFG15 citations83
LEE TSUNG-LIN
9 patentsUS9171929B2Oct 27, 2015
Strained structure of semiconductor device and method of making the strained structure
LEE TSUNG-LIN593 citations99
US8847293B2Sep 30, 2014
Gate structure for semiconductor device
LEE TSUNG-LIN518 citations99
US8610240B2Dec 17, 2013
Integrated circuit with multi recessed shallow trench isolation
LEE TSUNG-LIN192 citations99
US8497528B2Jul 30, 2013
Method for fabricating a strained structure
LEE TSUNG-LIN241 citations99
US8941153B2Jan 27, 2015
FinFETs with different fin heights
LEE TSUNG-LIN46 citations98
US8174073B2May 8, 2012
Integrated circuit structures with multiple FinFETs
LEE TSUNG-LIN51 citations94
US8445340B2May 21, 2013
Sacrificial offset protection film for a FinFET device
LEE TSUNG-LIN21 citations93
US9263342B2Feb 16, 2016
Semiconductor device having a strained region
LEE TSUNG-LIN13 citations84
US8653608B2Feb 18, 2014
FinFET design with reduced current crowding
LEE TSUNG-LIN12 citations84
YUAN FENG
3 patentsUS9953885B2Apr 24, 2018
STI shape near fin bottom of Si fin in bulk FinFET
YUAN FENG24 citations94
US8519481B2Aug 27, 2013
Voids in STI regions for forming bulk FinFETs
YUAN FENG35 citations94
US8592918B2Nov 26, 2013
Forming inter-device STI regions and intra-device STI regions using different dielectric materials
YUAN FENG8 citations84
SHIEH MING-FENG
2 patentsSILICON INTEGRATED SYS CORP
2 patentsSUN SEY-PING
1 patentCHEN HSIN-CHIH
1 patentVAN DAL MARK
1 patentShowing the top 50 of 138 patents by PatentIndex Score.