Inventor · disambiguated record
Anand Chandrashekar
Also filed as: CHANDRASHEKAR ANAND
51 granted patents·19 pending applications·1,420 citations·filing 2006–2024
99Inventor score
Top patents by PatentIndex Score
70 records- 0198US11069535B2Atomic layer etch of tungsten for enhanced tungsten deposition fillLAM RES CORP·Filed 2020·Granted Jul 20, 2021·7 cites·19 claims
- 0298US10916434B2Feature fill with multi-stage nucleation inhibitionLAM RES CORP·Filed 2020·Granted Feb 9, 2021·9 cites·19 claims
- 0398US10103058B2Tungsten feature fillNOVELLUS SYSTEMS INC·Filed 2017·Granted Oct 16, 2018·23 cites·13 claims
- 0498US9653353B2Tungsten feature fillNOVELLUS SYSTEMS INC·Filed 2013·Granted May 16, 2017·50 cites·16 claims
- 0598US9240347B2Tungsten feature fillNOVELLUS SYSTEMS INC·Filed 2014·Granted Jan 19, 2016·72 cites·20 claims
- 0698US8435894B2Depositing tungsten into high aspect ratio featuresCHANDRASHEKAR ANAND·Filed 2012·Granted May 7, 2013·314 cites·13 claims
- 0798US8153520B1Thinning tungsten layer after through silicon via fillingCHANDRASHEKAR ANAND·Filed 2009·Granted Apr 10, 2012·218 cites·22 claims
- 0897US11901227B2Feature fill with nucleation inhibitionLAM RES CORP·Filed 2021·Granted Feb 13, 2024·3 cites·18 claims
- 0997US10170320B2Feature fill with multi-stage nucleation inhibitionLAM RES CORP·Filed 2016·Granted Jan 1, 2019·20 cites·19 claims
- 1097US9997405B2Feature fill with nucleation inhibitionLAM RES CORP·Filed 2015·Granted Jun 12, 2018·22 cites·19 claims
- 1197US9972504B2Atomic layer etching of tungsten for enhanced tungsten deposition fillLAM RES CORP·Filed 2015·Granted May 15, 2018·21 cites·19 claims
- 1297US9236297B2Low tempature tungsten film deposition for small critical dimension contacts and interconnectsNOVELLUS SYSTEMS INC·Filed 2013·Granted Jan 12, 2016·38 cites·17 claims
- 1397US8835317B2Depositing tungsten into high aspect ratio featuresNOVELLUS SYSTEMS INC·Filed 2013·Granted Sep 16, 2014·33 cites·23 claims
- 1497US8623733B2Methods for depositing ultra thin low resistivity tungsten film for small critical dimension contacts and interconnectsCHEN FENG·Filed 2010·Granted Jan 7, 2014·36 cites·19 claims
- 1597US8124531B2Depositing tungsten into high aspect ratio featuresCHANDRASHEKAR ANAND·Filed 2011·Granted Feb 28, 2012·64 cites·20 claims
- 1696US11365479B2Ex situ coating of chamber components for semiconductor processingLAM RES CORP·Filed 2020·Granted Jun 21, 2022·8 cites·16 claims
- 1796US11075115B2Tungsten feature fillNOVELLUS SYSTEMS INC·Filed 2018·Granted Jul 27, 2021·11 cites·22 claims
- 1896US10580695B2Feature fill with nucleation inhibitionLAM RES CORP·Filed 2018·Granted Mar 3, 2020·13 cites·13 claims
- 1996US10580654B2Feature fill with multi-stage nucleation inhibitionLAM RES CORP·Filed 2018·Granted Mar 3, 2020·12 cites·14 claims
- 2096US10256142B2Tungsten feature fill with nucleation inhibitionNOVELLUS SYSTEMS INC·Filed 2013·Granted Apr 9, 2019·25 cites·23 claims
- 2196US9978610B2Pulsing RF power in etch process to enhance tungsten gapfill performanceLAM RES CORP·Filed 2016·Granted May 22, 2018·19 cites·18 claims
- 2296US9673146B2Low temperature tungsten film deposition for small critical dimension contacts and interconnectsNOVELLUS SYSTEMS INC·Filed 2016·Granted Jun 6, 2017·12 cites·15 claims
- 2396US9082826B2Methods and apparatuses for void-free tungsten fill in three-dimensional semiconductor featuresLAM RES CORP·Filed 2014·Granted Jul 14, 2015·37 cites·27 claims
- 2496US9034768B2Depositing tungsten into high aspect ratio featuresCHANDRASHEKAR ANAND·Filed 2010·Granted May 19, 2015·32 cites·21 claims
- 2596US8409987B2Method for depositing thin tungsten film with low resistivity and robust micro-adhesion characteristicsCHANDRASHEKAR ANAND·Filed 2011·Granted Apr 2, 2013·34 cites·19 claims
- 2696US8129270B1Method for depositing tungsten film having low resistivity, low roughness and high reflectivityCHANDRASHEKAR ANAND·Filed 2008·Granted Mar 6, 2012·37 cites·17 claims
- 2796US8058170B2Method for depositing thin tungsten film with low resistivity and robust micro-adhesion characteristicsCHANDRASHEKAR ANAND·Filed 2009·Granted Nov 15, 2011·83 cites·21 claims
- 2895US10211099B2Chamber conditioning for remote plasma processLAM RES CORP·Filed 2016·Granted Feb 19, 2019·24 cites·21 claims
- 2995US9548228B2Void free tungsten fill in different sized featuresLAM RES CORP·Filed 2014·Granted Jan 17, 2017·23 cites·12 claims
- 3095US8501620B2Method for depositing tungsten film having low resistivity, low roughness and high reflectivityCHANDRASHEKAR ANAND·Filed 2012·Granted Aug 6, 2013·16 cites·20 claims
- 3194US12227837B2Ex situ coating of chamber components for semiconductor processingLAM RES CORP·Filed 2022·Granted Feb 18, 2025·2 cites·19 claims
- 3294US10760158B2Ex situ coating of chamber components for semiconductor processingLAM RES CORP·Filed 2018·Granted Sep 1, 2020·14 cites·23 claims
- 3393US10566211B2Continuous and pulsed RF plasma for etching metalsLAM RES CORP·Filed 2017·Granted Feb 18, 2020·15 cites·21 claims
- 3493US10395944B2Pulsing RF power in etch process to enhance tungsten gapfill performanceLAM RES CORP·Filed 2018·Granted Aug 27, 2019·9 cites·17 claims
- 3591US11437269B2Tungsten feature fill with nucleation inhibitionNOVELLUS SYSTEMS INC·Filed 2019·Granted Sep 6, 2022·8 cites·28 claims
- 3691US9589835B2Method for forming tungsten film having low resistivity, low roughness and high reflectivityNOVELLUS SYSTEMS INC·Filed 2013·Granted Mar 7, 2017·8 cites·20 claims
- 3791US8883637B2Systems and methods for controlling etch selectivity of various materialsJENG ESTHER·Filed 2012·Granted Nov 11, 2014·23 cites·16 claims
- 3890US11410883B2Tungsten feature fill with nucleation inhibitionNOVELLUS SYSTEMS INC·Filed 2019·Granted Aug 9, 2022·5 cites·19 claims
- 3989US11978666B2Void free low stress fillLAM RES CORP·Filed 2019·Granted May 7, 2024·4 cites·20 claims
- 4088US10381266B2Tungsten feature fill with nucleation inhibitionNOVELLUS SYSTEMS INC·Filed 2017·Granted Aug 13, 2019·7 cites·20 claims
- 4187US12261081B2Tungsten feature fill with inhibition controlLAM RES CORP·Filed 2020·Granted Mar 25, 2025·2 cites·10 claims
- 4282US12173399B2Reducing line bending during metal fill processLAM RES CORP·Filed 2020·Granted Dec 24, 2024·1 cites·21 claims
- 4381US10977405B2Fill process optimization using feature scale modelingLAM RES CORP·Filed 2019·Granted Apr 13, 2021·3 cites·20 claims
- 4479US12163219B2Ex situ coating of chamber components for semiconductor processingLAM RES CORP·Filed 2022·Granted Dec 10, 2024·0 cites·19 claims
- 4579US12002679B2High step coverage tungsten depositionLAM RES CORP·Filed 2020·Granted Jun 4, 2024·1 cites·15 claims
- 4677US2025066907A1Reducing line bending during metal fill processLAM RES CORP·Filed 2024·Application pending·0 cites
- 4775US10199267B2Tungsten nitride barrier layer depositionLAM RES CORP·Filed 2017·Granted Feb 5, 2019·2 cites·20 claims
- 4874US2022115244A1Atomic layer etching of tungsten for enhanced tungsten deposition fillLAM RES CORP·Filed 2021·Application pending·0 cites
- 4974US2021327754A1Tungsten feature fillNOVELLUS SYSTEMS INC·Filed 2021·Application pending·0 cites
- 5074US2024234208A1Void free low stress fillLAM RES CORP·Filed 2024·Application pending·0 cites
Showing the top 50 of 70 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →