Inventor · disambiguated record
Angela Kessler
Also filed as: KESSLER ANGELA
47 granted patents·20 pending applications·236 citations·filing 2005–2025
97Inventor score
Files withINFINEON TECHNOLOGIES AG52INFINEON TECHNOLOGIES AUSTRIA AG8MAHLER JOACHIM4BAUER MICHAEL2INFINEON TECHNOLOGIES AUSTRIA1
Top patents by PatentIndex Score
67 records- 0194US7749797B2Semiconductor device having a sensor chip, and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2005·Granted Jul 6, 2010·36 cites·23 claims
- 0293US10211133B2Package with interconnections having different melting temperaturesINFINEON TECHNOLOGIES AG·Filed 2017·Granted Feb 19, 2019·8 cites·3 claims
- 0393US10074590B1Molded package with chip carrier comprising brazed electrically conductive layersINFINEON TECHNOLOGIES AG·Filed 2017·Granted Sep 11, 2018·16 cites·30 claims
- 0492US7464603B2Sensor component with a cavity housing and a sensor chip and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2007·Granted Dec 16, 2008·26 cites·15 claims
- 0590US11848262B2Semiconductor package and passive element with interposerINFINEON TECHNOLOGIES AG·Filed 2021·Granted Dec 19, 2023·2 cites·17 claims
- 0690US10586756B2Chip carrier configured for delamination-free encapsulation and stable sinteringINFINEON TECHNOLOGIES AG·Filed 2017·Granted Mar 10, 2020·6 cites·22 claims
- 0789US12033909B2Die package and method of manufacturing a die packageINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jul 9, 2024·2 cites·16 claims
- 0889US10242969B2Semiconductor package comprising a transistor chip module and a driver chip module and a method for fabricating the sameINFINEON TECHNOLOGIES AG·Filed 2013·Granted Mar 26, 2019·12 cites·13 claims
- 0988US7795727B2Semiconductor module having discrete components and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2007·Granted Sep 14, 2010·17 cites·14 claims
- 1086US7705436B2Semiconductor device with semiconductor chip and method for producing itINFINEON TECHNOLOGIES AG·Filed 2007·Granted Apr 27, 2010·13 cites·37 claims
- 1185US7629660B2Semiconductor sensor component including a sensor chip and methods for the manufacturing thereofINFINEON TECHNOLOGIES AG·Filed 2006·Granted Dec 8, 2009·14 cites·16 claims
- 1285US7462940B2Semiconductor component comprising flip chip contacts with polymer cores and method of producing the sameINFINEON TECHNOLOGIES AG·Filed 2007·Granted Dec 9, 2008·13 cites·15 claims
- 1385US7443019B2Semiconductor device with conductor tracks between semiconductor chip and circuit carrier and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2006·Granted Oct 28, 2008·13 cites·13 claims
- 1482US9536816B2Encapsulated electronic chip device with mounting provision and externally accessible electric connection structureINFINEON TECHNOLOGIES AG·Filed 2015·Granted Jan 3, 2017·5 cites·19 claims
- 1581US2025048531A1Power module with inductor-cooled power stageINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Application pending·0 cites
- 1680US12087740B2Method of forming a semiconductor moduleINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Granted Sep 10, 2024·0 cites·20 claims
- 1779US2024413127A1Method of Forming a Semiconductor ModuleINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Application pending·0 cites
- 1878US7768107B2Semiconductor component including semiconductor chip and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2006·Granted Aug 3, 2010·8 cites·13 claims
- 1976US8507080B2Thermoplastic-thermosetting composite and method for bonding a thermoplastic material to a thermosetting materialMAHLER JOACHIM·Filed 2006·Granted Aug 13, 2013·7 cites·14 claims
- 2076US8017438B2Semiconductor module with at least two substratesINFINEON TECHNOLOGIES AG·Filed 2006·Granted Sep 13, 2011·7 cites·7 claims
- 2176US8013441B2Power semiconductor device in lead frame employing connecting element with conductive filmINFINEON TECHNOLOGIES AG·Filed 2006·Granted Sep 6, 2011·7 cites·20 claims
- 2275US2024339371A1Die Package and Method of Manufacturing a Die PackageINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 2374US12150236B2Voltage regulator module with inductor-cooled power stageINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2022·Granted Nov 19, 2024·0 cites·23 claims
- 2474US12131988B2Semiconductor package and passive element with interposerINFINEON TECHNOLOGIES AG·Filed 2023·Granted Oct 29, 2024·0 cites·14 claims
- 2574US12009290B2Semiconductor module having a multi-branch switch node connectorINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Granted Jun 11, 2024·0 cites·20 claims
- 2674US10062671B2Circuit board embedding a power semiconductor chipINFINEON TECHNOLOGIES AG·Filed 2016·Granted Aug 28, 2018·2 cites·13 claims
- 2774US7834467B2Layer between interfaces of different components in semiconductor devicesINFINEON TECHNOLOGIES AG·Filed 2007·Granted Nov 16, 2010·6 cites·17 claims
- 2872US9633927B2Chip arrangement and method for producing a chip arrangementINFINEON TECHNOLOGIES AG·Filed 2013·Granted Apr 25, 2017·2 cites·19 claims
- 2972US7589403B2Lead structure for a semiconductor component and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2007·Granted Sep 15, 2009·5 cites·10 claims
- 3071US11817430B2Semiconductor moduleINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2021·Granted Nov 14, 2023·0 cites·18 claims
- 3170US8178390B2Semiconductor component and production methodMAHLER JOACHIM·Filed 2006·Granted May 15, 2012·3 cites·11 claims
- 3268US11664304B2Semiconductor moduleINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2021·Granted May 30, 2023·0 cites·19 claims
- 3368US9263425B2Semiconductor device including multiple semiconductor chips and a laminateINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Granted Feb 16, 2016·1 cites·22 claims
- 3467US12431367B2Embedded package with shielding padINFINEON TECHNOLOGIES AG·Filed 2023·Granted Sep 30, 2025·0 cites·20 claims
- 3566US7880300B2Semiconductor chip comprising a metal coating structure and associated production methodINFINEON TECHNOLOGIES AG·Filed 2007·Granted Feb 1, 2011·3 cites·23 claims
- 3666US2025174509A1Encapsulated package with carrier, laminate body and component in betweenINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
- 3761US7911039B2Component arrangement comprising a carrierINFINEON TECHNOLOGIES AG·Filed 2007·Granted Mar 22, 2011·1 cites·16 claims
- 3859US2025218914A1Package with component-carrying intermediate structure and additional carrier having reference potential structureINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 3959US2024105678A1Chip package, method of forming a chip package, and chip systemINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 4059US2021035879A1Encapsulated package with carrier, laminate body and component in betweenINFINEON TECHNOLOGIES AG·Filed 2020·Application pending·0 cites
- 4158US9859198B2Chip packages, chip arrangements, a circuit board, and methods for manufacturing chip packagesINFINEON TECHNOLOGIES AG·Filed 2014·Granted Jan 2, 2018·0 cites·5 claims
- 4258US7645642B2Method of joining a thermoplastic material to a thermoset material, and thermoplastic-thermoset compositeINFINEON TECHNOLOGIES AG·Filed 2006·Granted Jan 12, 2010·1 cites·17 claims
- 4358US2025183232A1Power stage package with half bridge-connected transistor chips and driver chip having through connectionINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 4457US12027436B2Package with clip having through hole accommodating component-related structureINFINEON TECHNOLOGIES AG·Filed 2022·Granted Jul 2, 2024·0 cites·20 claims
- 4557US10128180B2Chip packages, chip arrangements, a circuit board, and methods for manufacturing chip packagesINFINEON TECHNOLOGIES AG·Filed 2017·Granted Nov 13, 2018·0 cites·13 claims
- 4654US2024030820A1Modular power device package embedded in circuit carrierINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 4754US2023197577A1Semiconductor Devices Including a Premolded Leadframe and a Semiconductor PackageINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 4853US10283432B2Molded package with chip carrier comprising brazed electrically conductive layersINFINEON TECHNOLOGIES AG·Filed 2018·Granted May 7, 2019·0 cites·20 claims
- 4953US8440733B2Semiconductor component and production methodMAHLER JOACHIM·Filed 2012·Granted May 14, 2013·0 cites·18 claims
- 5053US2025015008A1Die embedded package and method of forming a die embedded packageINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
Showing the top 50 of 67 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →